PPE Black ESD Jedec IC Tray High Temperature For LGA Chip Package Type
Brand Name:Hiner-pack
Certification:ISO 9001 ROHS SGS
Model Number:HN21062
Minimum Order Quantity:1000 pcs
Delivery Time:5~8 working days
Payment Terms:T/T
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Location:
Shenzhen Guangdong China
Address:
Building A11,Zone D,West Industrial Zone,Minzhu Community, Date: 2022-7-15 Shajing Street,Baoan District,Shenzhen City,GD Province CN
Supplier`s last login times:
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Product Details
PPE Black ESD Jedec IC Tray High Temperature For LGA Chip Package Type
High Quality Jedec IC Tray For LGA Chip Package Type
ROHS Customized high temperature tray for LGA chip placement function
Quick Description:
Outline Line Size | 322.6*135.9*8.5mm | Brand | Hiner-pack |
Model | HN 21062 | Package Type | LGA |
Cavity Size | 28.2*28.2*3.35mm | Matrix QTY | 3*9=27PCS |
Material | PPE | Flatness | MAX 0.76mm |
Color | Black | Service | Accept OEM,ODM |
Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS |
In the microelectronics industry, there are standards for handling, loading, transporting and storing integrated circuit IC, modules and other electronic components. This is usually referred to as Jedec standard matrix trays. The Jedec Standard Tray is made from molded plastic particles. The Jedec standard Tray is very strong with minimal warpage control to achieve maximum protection of these components.
All Jedc matrix trays are 12.7*5.35inch(322.6*135.9mm) and are suitable for a variety of chip packages, including BGA.CSP.QFP.QFN... And so on.
Many Jedec tray slots are designed in the middle of the tray to allow automatic equipment to pick up the loaded product.
45-degree chamfer is also easier for equipment to identify and locate, thereby reducing labor costs.
Poduct Application
Package IC PCBA module component
Electronic component packaging Optical device packaging
Packaging Details:Packing according to customer's specified size
Reference to temperature resistance of different materials
Material | Bake Temperature | Surface Resistance |
PPE | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
MPPO+Carbon Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
MPPO+Carbon Powder | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
MPPO+Glass Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
PEI+Carbon Fiber | Max 180°C | 1.0*10E4Ω~1.0*10E11Ω |
IDP Color | 85°C | 1.0*10E6Ω~1.0*10E10Ω |
Color, temperature and other special requirements can be customized | ||
FAQ
1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as
possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us
with Skype / Email / Phone / Whatsapp, in case of any delays.
2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.
3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear
description of the IC or component.Provide one-stop service from
design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one
which is the most convenient or cost effective for you.
5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products
comply with the international JEDEC standards, to ensure 100%
qualified rate.
PPE Black ESD Jedec IC Tray High Temperature For LGA Chip Package Type
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