2 Inch Black Plastic IC Chip Tray For IC Devices
Brand Name:Hiner-pack
Certification:ISO 9001 ROHS SGS
Model Number:HN19100
Minimum Order Quantity:1000
Delivery Time:5~8 working days
Payment Terms:T/T
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Location:
Shenzhen Guangdong China
Address:
Building A11,Zone D,West Industrial Zone,Minzhu Community, Date: 2022-7-15 Shajing Street,Baoan District,Shenzhen City,GD Province CN
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Product Details
2 Inch Black Plastic IC Chip Tray For IC Devices
ESD Black Plastic Storage Chip Tray For For Carrying IC With Different Size
Chip tray is a carrier for bare dies used for the transportation
and handling of a small batch of dies. A waffle pack is typically a
plastic tray with pockets sized up for a particular die size.
IC Packaging delivery systems for protecting and transporting bare
die, CSP, ... die (KGD), chip scale packaging (CSP), and wafer
scale packaging (WSP).
The Key Differences Between ESD and Anti-Static.
Anti-static have a coating or chemical additive that dissipates
static across its surface so you never build up enough charge to
get a shock. ESD is a much more robust solution that delivers
greater long-term results because it is actually earthed
Hiner-pack supplies a wide range of chip trays and shipping IC trays for safely storing and transporting IC (Integrated Circuits), other components and modules.
Our Advantages
1. Flexible OEM service: we can produce products according to customer’s sample or design.
2. Various Materials: the material can be MPPO.PPE.ABS.PEI.IDP...etc.
3. Complicated workmanship: tooling making, Injection molding,Production
4. Comprehensive customer service: from customer consultation to after sales service.
5. 10 years’ex perience of OEM for USA and EU customers.
6. We have our own factory and can control quality in high level and produce products quickly and flexibly.
Refer to detail
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
| 2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.2mm | Customizable |
| 3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.25mm | Customizable |
| 4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.3mm | Customizable |
| Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | TBC | Customizable |
| Provide professional design and packaging for your products | |||||
| Outline Line Size | 50.7*50.7*4mm | Brand | Hiner-pack |
| Model | HN19100 | Package Type | IC Parts |
| Cavity Size | 2.03*2.5*0.66mm | Matrix QTY | 12*14=168PCS |
| Material | PC | Flatness | MAX 0.2mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS |
Product Application
Wafer Die / Bar / Chips PCBA module component
Electronic component packaging Optical device packaging
Packaging Details
Packing according to customer's specified size
FAQ
Q: Can you do OEM and customized design IC tray?
A: We have strong mold manufacturing and product design
capabilities, in the mass production of all kinds of IC trays also
have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase QTY
of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged
according to different product value.and all samples shipping cost
normally is by collect or as agreed.
Q: What kind of Incoterm you can do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP
etc. and other incoterm as agreed.
Q: What method you can help ship the goods?
A: By sea, by air, or by express, by mail post according to
customer order qty and volume.
2 Inch Black Plastic IC Chip Tray For IC Devices
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