OEM Black Anti Static Bare Die Trays 2 Inch Non Toxic RoHS Standard

OEM Black Anti-Static Bare Die Trays 2 Inch Non-Toxic RoHS Standard

Stackable, reusable, and automation-ready—our chip trays are built for semiconductor production lines.

High-temperature resistance waffle pack tray is specifically designed to support semiconductor and microelectronic components during thermal processes such as solder reflow, die attach curing, and burn-in testing. Constructed from advanced bakeable plastic compounds, the tray maintains structural integrity and dimensional stability at elevated temperatures. Its 2x2 inch footprint and precision-molded pocket layout are ideal for flat or semi-flat components like CSPs, bare die, and passive devices. The tray offers reliable protection and orientation throughout high-temperature workflows while being fully compatible with automation equipment, including pick-and-place arms and tray shuttling systems.

Advantages:

1. More than 12 years of export experience.

2. With professional engineers and efficient management.

3. Short delivery time and good quality.

4. Support small batch production in the first batch.

5. Professional sales within 24 hours efficient reply.

6. The factory has ISO certification, and the products comply with the RoHS standard.

7. Our products are exported to the United States, Germany, the UK, Korea, Japan, Israel, Malaysia, etc. won the praise of many customers, with service or cost performance being well recognized.

Application:

Wafer Die / Bare / Chips; PCBA module component; Electronic component packaging; Optical device packaging

Technical Parameters:

FAQ:

Q: Can you do OEM and customized design IC trays?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase quantity of orders.
Q: Do you provide samples? Is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value.and all samples shipping cost normally is by collect or as agreed.
Q: What kind of Incoterms can you do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
Q: What method can you use to ship the goods?
A: By sea, by air, or by express, by mail post according to customer order qty and volume.

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions. Hiner-pack has mastered special processing techniques and manufacturing in the semiconductor packaging raw material field. Owned a lot of inventions and practical new patents. Through years of unremitting efforts, Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to be launched, and to solve the customer demand for high-quality products.

Learn more through our official website: https://www.hiner-pack.com/english/