ODM Anti Static Bare Die Trays CSP Chip Scale Package Transporting IC
Brand Name:Hiner-pack
Certification:ISO 9001 ROHS SGS
Model Number:3 Inch Series
Minimum Order Quantity:1000 pcs
Delivery Time:5~8 working days
Payment Terms:T/T
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Verified Supplier
Location:
Shenzhen Guangdong China
Address:
Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Supplier`s last login times:
within 1 hours
Product Details
Company Profile
Product Details
ODM Anti Static Bare Die Trays CSP Chip Scale Package Transporting IC
Factory Customized 3-Inch Anti-Static Tray To Load The Bar In Chip Level Package
Hiner-pack supplies a wide range of Matrix trays and shipping IC trays for safely storing and transporting IC (Integrated Circuits), other components and modules.
IC Packaging delivery systems for protecting and transporting bare
die, CSP, ... die (KGD), chip scale packaging (CSP), and wafer
scale packaging (WSP).
Laser Bar or Touch Bar and other products are light and brittle,
and it is easy to cause oxidation or damage due to improper
operation. Under the fully automated operating system, there are
strict requirements on packaging materials and boxes. The
anti-static trays produced not only need to fully protect the
products, but also need to deal with debugging such as the turnover
of automatic equipment.At the same time in the process of
transportation and transit also have high requirements, our company
has accumulated a lot of experience in the production of such
products, can fully respond to the diversified needs of customers,
to provide set design.One - stop packaging solution production
Advantages
1. Light weight, saving transportation and packaging costs;
2. Size specification, compatible in any 2 ", 3 "or 4" Waffle Pack
Feeder Machine;
3. Good anti-static performance, effectively ensure that the
product is not damaged by anti-static release;
4. High temperature resistance, suitable for high temperature
automation equipment assembly;
5. Corrosion resistance, suitable for all kinds of production
conditions of products;
6. Matrix arrangement design, under the premise of protecting the
product, the most dozen capacity design, cost saving;
7. Edge chamfer design, effectively prevent stacking error, correct
the direction of placement
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
| 2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.2mm | Customizable |
| 3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.25mm | Customizable |
| 4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.3mm | Customizable |
| Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | TBC | Customizable |
| Provide professional design and packaging for your products | |||||
| Usage | Packaging of Electronic Components,Optical device, |
| Feature | ESD, Durable, High Temperature, Waterproof, Recycled, Eco-friendly |
| Material | MPPO.PPE.ABS.PEI.IDP...etc |
| Color | Black.Red.Yellow.Green.White and custom color |
| Size | Customized size, rectangle,circle shape |
| Mold type | Injection Mold |
| Design | Original sample or we can create the designs |
| Packing | By Carton |
| Sample | Sample time: after draft confirmed and payment arranged |
| Sample charge: 1. Free for stock samples | |
| 2. Custom Tray negotiated | |
| Lead Time | 5-7 Working days |
| The exact time should according to the ordered quantity |
Product Application
Wafer Die / Bar / Chips PCBA module component
Electronic component packaging Optical device packaging
Packaging
Packaging Details:Packing according to customer's specified size
FAQ
Q: Can you do OEM and customized design IC tray?
A: We have strong mold manufacturing and product design
capabilities, in the mass production of all kinds of IC trays also
have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase QTY
of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged
according to different product value.and all samples shipping cost
normally is by collect or as agreed.
Q: What kind of Incoterm you can do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP
etc. and other incoterm as agreed.
Q: What method you can help ship the goods?
A: By sea, by air, or by express, by mail post according to
customer order qty and volume.
ODM Anti Static Bare Die Trays CSP Chip Scale Package Transporting IC
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