ESD Waffle Pack Electronic Components Tray
Brand Name:Hiner-pack
Certification:ISO 9001 ROHS SGS
Model Number:To meet all kinds of custom needs of customers
Minimum Order Quantity:1000 pcs
Delivery Time:5~8 working days
Payment Terms:T/T
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Verified Supplier
Location:
Shenzhen Guangdong China
Address:
Building A11,Zone D,West Industrial Zone,Minzhu Community, Date: 2022-7-15 Shajing Street,Baoan District,Shenzhen City,GD Province CN
Supplier`s last login times:
within 1 hours
Product Details
Company Profile
Product Details
ESD Waffle Pack Electronic Components Tray
Durable Antistatic ABS Non-Standard Waffle Pack With Different Size
Can Be Customized For Optoelectronic Components
As the tray in the field of optical application, more and more
customers in order to protect components or optical devices, are
willing to choose injection molding tray for packaging solution,
because the tray can carrier component also provides comprehensive
protection to transit and transport provides great convenience, all
kinds of specifications and various color can be realized,Provide
one-stop service from design to production to packaging.
Chip tray is a carrier for bare dies used for the transportation
and handling of a small batch of dies. A waffle pack is typically a
plastic tray with pockets sized up for a particular die size.
IC Packaging delivery systems for protecting and transporting bare
die, CSP, ... die (KGD), chip scale packaging (CSP), and wafer
scale packaging (WSP).
Advanges
1. More than 10 years export experience
2. With professional engineers and efficient management
3. Short delivery time and good quality
4. Support small batch production in the first batch
5. Professional sales within 24 hours efficient reply
6. Factory has ISO certification, and the products comply to RoHS
standard.
7. Our products are exported to the United States, Germany, UK,
Korea, Japan, Israel, Malaysia, etc. won the praise of many
customers, service or cost performance has been well recognized
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
| 2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.2mm | Customizable |
| 3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.25mm | Customizable |
| 4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.3mm | Customizable |
| Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | TBC | Customizable |
| Provide professional design and packaging for your products | |||||
Product Application
Wafer Die / Bar / Chips PCBA module component
Electronic component packaging Optical device packaging
Packaging
Packaging Details:Packing according to customer's specified size
FAQ
Q: Can you do OEM and customized design IC tray?
A: We have strong mold manufacturing and product design
capabilities, in the mass production of all kinds of IC trays also
have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase QTY
of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged
according to different product value.and all samples shipping cost
normally is by collect or as agreed.
Q: What kind of Incoterm you can do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP
etc. and other incoterm as agreed.
Q: What method you can help ship the goods?
A: By sea, by air, or by express, by mail post according to
customer order qty and volume.
ESD Waffle Pack Electronic Components Tray
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