Recycled ESD Custom Jedec Trays Die Transport BGA Chips High Temperature resistance 180°C
Brand Name:Hiner-pack
Certification:ISO 9001 ROHS SGS
Model Number:HN1839 Black
Minimum Order Quantity:1000 pcs
Delivery Time:5~8 working days
Payment Terms:T/T
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Location:
Shenzhen Guangdong China
Address:
Building A11,Zone D,West Industrial Zone,Minzhu Community, Date: 2022-7-15 Shajing Street,Baoan District,Shenzhen City,GD Province CN
Supplier`s last login times:
within 1 hours
Product Details
Company Profile
Product Details
Recycled ESD Custom Jedec Trays Transport BGA Chips High
Temperature
Customize JEDEC Standard High Temperature Black IC Tray For BGA Chips
Character Reference
Material: PPE
Thickness: 7.62,12.19mm
Appearance: black
Customized: width and length, thickness as customer request
Conductive: 10e4-10e6 ohms
Anti-static: 1.0*10e4-1.0*10e11 ohms
The design of the structure and shape in line with JEDEC
international standards can also perfectly meet the requirements of
the carriing components or IC of the tray, carriing function to
meet the requirements of the automatic feeding system, to achieve
the modernization of loading, improve work efficiency.
Providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing IC but also better protect the chip storage.We have designed a lot of packaging way, which also contains common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC and SiP, etc.We can provide custom service for all packaging methods of chip tray.
Benefits
Able to present non-standard components to Pick and Place machines
Multiple uses for fixture including component bake-out, storage and shipping
Cost effective alternative to “tape and reel” or “hand” placement
Application:
IC, Electronic component, Semiconductor, Micro and Nano systems and Sensor IC etc
| Model | HN1839 | Package Type | BGA IC |
| Cavity Size | 12*12*1.8mm | Size | Customized |
| Material | PPE | Flatness | MAX 0.76mm |
| Resistance | 1.0x10e4-1.0x10e11Ω | Service | Accept OEM,ODM |
| Color | Green &Black | Certificate | ROHS |
| Usage | Packaging of Electronic Components,Optical device, |
| Feature | ESD, Durable, High Temperature, Waterproof, Recycled, Eco-friendly |
| Material | MPPO.PPE.ABS.PEI.IDP...etc |
| Color | Black.Red.Yellow.Green.White and custom color |
| Size | Customized size, rectangle,circle shape |
| Mold type | Injection Mold |
| Design | Original sample or we can create the designs |
| Packing | By Carton |
| Sample | Sample time: after draft confirmed and payment arranged |
| Sample charge: 1. Free for stock samples | |
| 2. Custom Tray negotiated | |
| Lead Time | 5-7 Working days |
| The exact time should according to the ordered quantity |
FAQ
Q1. Do your products get any certificates?
Yes, CE for EU market, FDA for USA market.
Q2.Can you do the design for us?
Yes. We have a professional team having rich experience in
designing and manufacturing. Just tell us your ideas and we will
help to carry out your ideas into perfect fact. It does not matter
if you do not have some one to complete files. Send us high
resolution images, your logo and text and tell us how you would
like to arrange them. We will send you finished files for
confirmation.
Q3. How long is the delivery time?
For standard machine, it would be 5-7Working days. For
non-standard/customized machines according to clients' specific
requirements, It would be 20~25 working days.
Q4. Do you arrange shipment for the products?
It’s depends on our incoterms,If FOB or CIF price, we will arrange
shipment for you, but EXW price, clients need to arrange shipment
by themselves or their agents.
Q5. How about the documents after shipment?
After shipment, we'll send all original documents to you by DHL,
including Commercial Invoice, Packing List, B/L and other
certificates as required by clients.
Recycled ESD Custom Jedec Trays Die Transport BGA Chips High Temperature resistance 180°C
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