DRAM IC ESD Component Tray For Electronics Parts Packing
Brand Name:Hiner-pack
Certification:ISO 9001 ROHS SGS
Model Number:HN1876 Yellow
Minimum Order Quantity:1000 pcs
Delivery Time:5~8 working days
Payment Terms:T/T
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Location:
Shenzhen Guangdong China
Address:
Building A11,Zone D,West Industrial Zone,Minzhu Community, Date: 2022-7-15 Shajing Street,Baoan District,Shenzhen City,GD Province CN
Supplier`s last login times:
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Product Details
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Product Details
DRAM IC ESD Component Tray For Electronics Parts Packing
ESD PC IC Trays With Different Cavities Can Be Customized For DRAM
IC
Quick Detail
1. Designs conforms JEDEC international standard, and has strong
versatility.
2. Optimal product design,can provide a variety of packaging IC with
protection and while reducing transportation costs.
3. V type tray designs, with added protection for IC substrate edge
ball placement.
4. A variety of materials for customers to choose from to meet your
ESD and process requirements.
5. Support for non- standard format customization.
6. BGA,QFN,QFP,PGA,TQFP,LQFP, SoC SiP etc. All packaging methods are
available. Can be customized based on customers requirement(e.g:
ESD property, Baking Temp,Baking Time).
7.The design of the structure and shape in line with Jedec
international standards can also perfectly meet the requirements of
the carriing components or IC of the tray, carriing function to
meet the requirements of the automatic feeding system, to achieve
the modernization of loading, improve work efficiency.
| Jedec Tray | |||
| Outline Line Size | 322.6*135.9*7.62mm | Brand | Hiner-pack |
| Model | HN1876 | Package Type | IC |
| Cavity Size | 2.9X4.1X2.7mm | Size | Customized |
| Material | PC | Flatness | MAX 0.76mm |
| Resistance | 1.0x10e4-1.0x10e11Ω | Service | Accept OEM,ODM |
| Color | Yellow | Certificate | ROHS |
Product Application
Package IC PCBA module component
Electronic component packaging Optical device packaging
Packaging
Packaging Details:Packing according to customer's specified size
| Material | Bake Temperature | Surface Resistance |
| PPE | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Powder | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Glass Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| PEI+Carbon Fiber | Max 180°C | 1.0*10E4Ω~1.0*10E11Ω |
| IDP Color | 85°C | 1.0*10E6Ω~1.0*10E10Ω |
| Color, temperature and other special requirements can be customized | ||
FAQ
1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as
possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us
with Skype / Email / Phone / Whatsapp, in case of any delays.
2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.
3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear
description of the IC or component.Provide one-stop service from
design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is
the most convenient or cost effective for you.
5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products
comply with the international JEDEC standards, to ensure 100%
qualified rate.
DRAM IC ESD Component Tray For Electronics Parts Packing
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