Electronic Components Waffle Pack Chip Trays ABS ESD Trays For IC

Electronic Components Waffle Pack Chip Trays ABS ESD Trays For IC

Need reliable chip handling solutions? Our Waffle Pack (Chip Tray) provides consistent cavity alignment and secure protection from contamination.

Hollow Chip Trays Are Designed To Avoid Contact With Sensitive Areas Of Electronic Components.

The use of anti-static tray storage for electronic components can effectively avoid the short-circuit phenomenon. Because the product is prone to friction in the process of placement and transportation, if there is some static electricity on the circuit board of the product, it is easy to lead to a short circuit of the circuit board, affecting the quality of the product, and may even cause damage.

Waffle Pack is a form of packaging designed for use with parts that are either very small or unusual in shape. Waffle packs are embossed or pocketed trays, typically made of plastic, that resemble a breakfast waffle (hence the name). The waffle packs are loaded using pick and place equipment so that the "inside" of each pocket contains a part or component. Once loaded, the parts are covered with anti-static paper, and then a foam-covered crown holds the parts in place, and finally, a lid secures the waffle package together.

Application:

Semiconductor Wafer Die, Wafer Bare, Electronic components, optical electronic components, etc.

Advantages:

1. Flexible OEM service: We can produce products according to the customer’s sample or design.

2. Various Materials: The material can be MPPO.PPE.ABS.PEI.IDP...etc.

3. Complicated workmanship: tooling making, Injection molding, Production

4. Comprehensive customer service: from customer consultation to after-sales service.

5. 12 years of experience in OEM for USA and EU customers.

6. We have our own factory and can control quality at a high level and produce products quickly and flexibly.

Technical Parameters:

FAQ:

Q1. Do your products get any certificates?
Yes, CE for the EU market, FDA for the USA market.
Q2.Can you do the design for us?
Yes. We have a professional team having rich experience in designing and manufacturing. Just tell us your ideas and we will help to carry out your ideas into perfect fact. It does not matter if you do not have some one to complete files. Send us high resolution images, your logo and text and tell us how you would like to arrange them. We will send you finished files for confirmation.
Q3. How long is the delivery time?
For standard machine, it would be 5-7Working days. For non-standard/customized machines according to clients' specific requirements, It would be 20~25 working days.
Q4. Do you arrange shipment for the products?

It’s depends on our incoterms,If FOB or CIF price, we will arrange shipment for you, but EXW price, clients need to arrange shipment by themselves or their agents.
Q5. How about the documents after shipment?
After shipment, we'll send all original documents to you by DHL, including Commercial Invoice, Packing List, B/L and other certificates as required by clients.

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions. Hiner-pack has mastered special processing techniques and manufacturing in the semiconductor packaging raw material field. Owned a lot of inventions and practical new patents. Through years of unremitting efforts, Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to be launched, and to solve the customer demand for high-quality products.

Learn more through our official website: https://www.hiner-pack.com/english/