Customized Black ESD Jedec IC Trays Ultrasonic Cleaning For PCBA Module
Brand Name:Hiner-pack
Certification:ISO 9001 ROHS SGS
Model Number:HN18102
Minimum Order Quantity:1000 pcs
Delivery Time:5~8 working days
Payment Terms:T/T
Contact Now
Add to Cart
Verified Supplier
Location:
Shenzhen Guangdong China
Address:
Building A11,Zone D,West Industrial Zone,Minzhu Community, Date: 2022-7-15 Shajing Street,Baoan District,Shenzhen City,GD Province CN
Supplier`s last login times:
within 1 hours
Product Details
Company Profile
Product Details
Customized Black ESD Jedec IC Trays Ultrasonic Cleaning For PCBA
Module
PPE Jedec Trays With Different Cavity Can Be Customized For PCBA
Quick Description:
| Outline Line Size | 322.6*135.9*7.62mm | Brand | Hiner-pack |
| Model | HN 18102 | Package Type | PCBA |
| Cavity Size | 35*35*3.05mm | Matrix QTY | 3*7=21PCS |
| Material | PPE | Flatness | MAX 0.76mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS |
1. Standard Jedec Tray Outline size is 322.6X135.9X7.62mm or
322.6*135.9*12.19mm.
2. The production process is injection molded products.
3. Rich experience and mature design team in the field of injection
molding products, providing one-stop services from design to mold
to product packaging
While the Jedec Tray is widely used in the semiconductor industry,
the PCB module market is slowly recognizing and using custom trays
to transport and load modules, because it can not only fully meet
customer requirements in terms of performance, but also match the
market demand for high-end modules. The IC Tray has been fully
recognized in different industries.We have accumulated a wealth of
experience in loading different IC and modules, and have produced
many similar series of trays.
Product Application
Package IC PCBA module component
Electronic component packaging Optical device packaging
Packaging
Packaging Details:Packing according to customer's specified size
Reference to temperature resistance of different materials
| Material | Bake Temperature | Surface Resistance |
| PPE | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Powder | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Glass Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| PEI+Carbon Fiber | Max 180°C | 1.0*10E4Ω~1.0*10E11Ω |
| IDP Color | 85°C | 1.0*10E6Ω~1.0*10E10Ω |
| Color, temperature and other special requirements can be customized | ||
FAQ
1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as
possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us
with Skype / Email / Phone / Whatsapp, in case of any delays.
2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.
3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear
description of the IC or component.Provide one-stop service from
design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one
which is the most convenient or cost effective for you.
5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products
comply with the international JEDEC standards, to ensure 100%
qualified rate.
Customized Black ESD Jedec IC Trays Ultrasonic Cleaning For PCBA Module
Inquiry Cart
0