ODM PCB Module ESD Packaging Trays 18PCS 322.6x135.9mm Black Color
Brand Name:Hiner-pack
Certification:ISO 9001 ROHS SGS
Model Number:HN1903
Minimum Order Quantity:1000 pcs
Delivery Time:5~8 working days
Payment Terms:T/T
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Location:
Shenzhen Guangdong China
Address:
Building A11,Zone D,West Industrial Zone,Minzhu Community, Date: 2022-7-15 Shajing Street,Baoan District,Shenzhen City,GD Province CN
Supplier`s last login times:
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Product Details
ODM PCB Module ESD Packaging Trays 18PCS 322.6x135.9mm Black Color
ESD PPE Jedec Trays With Different Temperature Can Be Customized
For PCB Module
While the Jedec Tray is widely used in the semiconductor industry,
the PCB module market is slowly recognizing and using custom trays
to transport and load modules, because it can not only fully meet
customer requirements in terms of performance, but also match the
market demand for high-end modules. The IC Tray has been fully
recognized in different industries.We have accumulated a wealth of
experience in loading different IC and modules, and have produced
many similar series of trays.
Detail Information:
| Outline Line Size | 322.6*135.9*7.62mm | Brand | Hiner-pack |
| Model | HN1903 | Package Type | PCB Module |
| Cavity Size | 43*38*3.25mm | Matrix QTY | 6*3=18PCS |
| Material | MPPE | Flatness | MAX 0.76mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS |
Jedec trays is a standard-defined tray for transporting, handling,
and storing complete chips and other components,and the production come in the very same outline dimensions of 12.7 inches by 5.35
inches (322.6 mm x 135.89 mm). Trays come in a number of different
profiles.
The tray has a 45-degree chamfer to provide the visual indicator of Pin 1 orientation of the IC and prevent the stack of errors, reduce the possibility of workers making mistakes and maximize the protection of the chip.
Product Application
Package IC PCBA module component
Electronic component packaging Optical device packaging
Packaging
Packaging Details:Packing according to customer's specified size
Reference to temperature resistance of different materials
| Material | Bake Temperature | Surface Resistance |
| PPE | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Powder | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Glass Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| PEI+Carbon Fiber | Max 180°C | 1.0*10E4Ω~1.0*10E11Ω |
| IDP Color | 85°C | 1.0*10E6Ω~1.0*10E10Ω |
| Color, temperature and other special requirements can be customized | ||
FAQ
1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as
possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us
with Skype / Email / Phone / Whatsapp, in case of any delays.
2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.
3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear
description of the IC or component.Provide one-stop service from
design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is the most convenient or cost
effective for you.
5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply
with the international JEDEC standards, to ensure 100% qualified
rate.
ODM PCB Module ESD Packaging Trays 18PCS 322.6x135.9mm Black Color
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