QFP Package ESD IC Trays Jedec Standard Max 0.76mm Flatness
Brand Name:Hiner-pack
Certification:ISO 9001 ROHS SGS
Model Number:HN1968
Minimum Order Quantity:1000 pcs
Delivery Time:5~8 working days
Payment Terms:T/T
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Location:
Shenzhen Guangdong China
Address:
Building A11,Zone D,West Industrial Zone,Minzhu Community, Date: 2022-7-15 Shajing Street,Baoan District,Shenzhen City,GD Province CN
Supplier`s last login times:
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Product Details
QFP Package ESD IC Trays Jedec Standard Max 0.76mm Flatness
Anti-static PPE Standard Jedec Trays Customized For Carry QFP
Package IC
Detail Description:
Tray of QFP package way,Really need to pay special attention to
protect the edge of the pin location, structure and shape,
different pin each sensitive area is different need to be
protected, IC tray design is the first need to consider is safe
packing storage chip, the IC package of reason for different ways
have different design methods, this QFP IC two side both have pin
structure,Our designer added grooves on both sides, so that the
pins can be placed smoothly to avoid being touched, and the middle
card slot can also be fixed on the chip, so that it can be picked
up by automatic equipment on the basis of safe storage of the chip,
which is more conducive to shipment and storage.
Providing a variety of packaging IC design solutions based on your
chip, the 100% custom tray is not only suitable for storing IC but
also better protect the chip storage.We have designed a lot of
packaging way, which also contains common BGA, FBGA, LGAQFN, QFP,
PGA, TQFP, LQFP, SoC and SiP, etc.We can provide custom service for
all packaging methods of chip tray.
| Outline Line Size | 322.6*135.9*12.19mm | Brand | Hiner-pack |
| Model | HN1968 | Package Type | QFP IC |
| Cavity Size | 22*22*6.9 | Matrix QTY | 11*4=44pcs |
| Material | PPE | Flatness | MAX 0.76mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS |
Product Application
Package IC PCBA module component
Electronic component packaging Optical device packaging
Packaging
Packaging Details:Packing according to customer's specified size
Reference to temperature resistance of different materials
| Material | Bake Temperature | Surface Resistance |
| PPE | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Powder | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Glass Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| PEI+Carbon Fiber | Max 180°C | 1.0*10E4Ω~1.0*10E11Ω |
| IDP Color | 85°C | 1.0*10E6Ω~1.0*10E10Ω |
| Color, temperature and other special requirements can be customized | ||
FAQ
1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as
possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us
with Skype / Email / Phone / Whatsapp, in case of any delays.
2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.
3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear
description of the IC or component.Provide one-stop service from
design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is the most convenient or cost
effective for you.
5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply
with the international JEDEC standards, to ensure 100% qualified
rate.
QFP Package ESD IC Trays Jedec Standard Max 0.76mm Flatness
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