The ICP (Inductively Coupled Plasma) etching process in LED chip manufacturing is called Inductively Coupled Plasma etch
Brand Name:ZG
Certification:CE
Model Number:MS
Minimum Order Quantity:1 piece
Delivery Time:3 working days
Payment Terms:L/C, D/A, D/P, T/T, Western Union, MoneyGram
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Location:
Zhengzhou Henan China
Address:
No. 26, Dongqing Street, High-tech Zone, Zhengzhou ,Henan, China
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within 48 hours
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SiC ICP Tray
Silicon carbide ICP tray is formed by isostatic pressing process and sintering at high temperature. The outer diameter, thickness, number and size of acupoints, position and shape of the tablet groove can also be finished according to the requirements of the user's design drawings to meet the specific requirements of the user.
Typical applications
- The ICP (Inductively Coupled Plasma) etching process in LED chip manufacturing is called Inductively Coupled Plasma etching.
Features and advantages
- Good thermal conductivity, low coefficient of expansion and temperature uniformity
- Plasma impact resistance
- Can be made according to the specific size requirements of customers, the maximum diameter can reach 495MM
- Resistant to all kinds of strong acid and alkali chemical reagent corrosion
Specifications:Diameter 330/380mm
The ICP (Inductively Coupled Plasma) etching process in LED chip manufacturing is called Inductively Coupled Plasma etch
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