1.6mm Multi-Layers Hdi Pcb Board 53.7*56mm Size

Brand Name:HNL-PCBA
Certification:ISO9001,IS16949, ISO14001,ROHS , UL, IPC-A , UL, QC080000
Model Number:PCB Assembly 012
Minimum Order Quantity:3 PC
Delivery Time:1-7days
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ENIG 2.0mm Multi-layers 1oz HDI PCB Printed Circuit Board

HDI PCB Board Introduction


High Density Interconnection,shorted as (HDI) PCB, is a kind of (technology) for the production of printed circuit boards. It is a circuit board with relatively high circuit distribution density using micro blind via and buried via technology. Adopting the structure of Stripline and Microstrip, multi-layering becomes a necessary design. In order to reduce the quality problem of signal transmission, insulating materials with low dielectric constant and low attenuation rate are used. To meet the miniaturization and arraying of electronic components, the density of circuit boards is constantly increasing to meet the demand.


PCB CAPABILITIES

FACTORY CAPABILITIES
No.Items2020
1HDI CapabilitiesHDI ELIC(5+2+5)
2Max layer count46L
3Board ThicknessCore thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm
4Min.Hole SizeLaser 0.05mm
Mechnical 0.15mm
5Min Line Width/Space0.030mm/0.030mm
6Copper Thickness1/3oz-6oz
7Size Max Panel size700x610mm
8Registration Accuracy+/-0.05mm
9Routing Accuracy+/-0.05mm
10Min.BGA PAD0.125mm
11Max Aspect Ratio10:01
12Bow and Twist0.50%
13Impedance Control Tolerance+/-5%
14Daily output4,000m2 (Max capacity of equipment)
15Surface FinishingHASL Lead Free /ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
16Raw MaterialFR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI

The types of HDI PCB


1.through vias from surface to surface,
2.with buried vias and through vias,
3.two or more HDI layer with through vias,
4.passive substrate with no electrical connection,
5.coreless construction using layer pairs
6.alternate constructions of coreless constructions using layer pairs.


HDI (High Density Interconnection) circuit boards usually include laser blind vias and mechanical blind vias; general through buried vias, blind vias, stacked vias, staggered vias, cross blind buried, through vias, blind via filling plating, fine line small gaps, The technology of realizing the conduction between the inner and outer layers by processes such as micro-holes in the disk, usually the diameter of the blind buried is not more than 6 mils.


Work flow for HDI


Board Cut - Inner Wet film -DES - AOI - Brown Oxido - Outer Layer Press - Out Layer Lamination - X-RAY & Rounting - Copper reduce & brown oxide - Laser Drilling - Drilling - Desmear PTH - Panel plating - Outer Layer dry film - Etching - AOI- Impedance Testing - S/M Pluged hole - Solder Mask - Component Mark - Impedance testing - Immersion Gold -V-cut - Routing - Electrical Test - FQC - FQA -Package -Shipment



Similar products PCBA goods



Workshop



Common packaging


1.PCB: Vacuum packaging with carton box
2.PCBA: ESD packaging with carton box



Our advantage


1.Service value

Independent quotation system to quickly serve the market

2.PCB manufacturing

High-tech PCB and PCB assembly production line

3.Material purchasing

A team of experienced electronic component procurement engineers

4.SMT post soldering

Dust-free workshop, high-end SMT patch processing


China 1.6mm Multi-Layers Hdi Pcb Board 53.7*56mm Size supplier

1.6mm Multi-Layers Hdi Pcb Board 53.7*56mm Size

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