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Titanium Tube Target Titanium Gr1 ASTM B861-06 a 133OD*125ID*840L Sputtering Vacuum Coating Target
Item name | Titanium tube target |
Size | φ133*φ125*840 |
Grade | Gr1 |
Packaging | Vacuum package in wooden case |
Port of place | Xi'an port, Beijing port, Shanghai port, Guangzhou port, Shenzhen port |
The coating target is a sputtering source that forms various
functional films on the substrate by magnetron sputtering,
multi-arc ion plating or other types of coating systems under
appropriate technological conditions. To put it simply, the target
material is the target material of high-speed charged particles
bombardment. When used in high-energy laser weapons, different
power densities, different output waveforms and different
wavelengths of laser interact with different targets, different
killing and destruction effects will be produced. For example,
evaporative magnetron sputtering coating is heated evaporation
coating, aluminium film, etc. Change different target materials
(such as aluminium, copper, stainless steel, titanium, nickel
target, etc.), can get different film systems (such as super hard,
wear-resistant, anti-corrosion alloy film, etc.)
An orthogonal magnetic field and electric field are added between
the sputtered target pole (cathode) and anode, and the required
inert gas (usually Ar gas) is filled in a high vacuum chamber. The
permanent magnet forms a magnetic field of 250 ~ 350 Gauss on the
surface of the target material, which forms an orthogonal
electromagnetic field with the high voltage electric field. Under
the action of electric field, Ar gas ionization into positive ions
and electrons, target and has certain negative pressure, from the
action of the target from the extremely affected by magnetic field
and increase of working gas ionization probability, form a high
density plasma near the cathode, Ar ion under the action of lorentz
force, speed up to fly to the target surface, bombarding target
surface at a high speed, The sputtered atoms on the target follow
the momentum conversion principle and fly away from the target with
high kinetic energy to the substrate for film deposition. Magnetron
sputtering is generally divided into two kinds: DC sputtering and
rf sputtering. The principle of DC sputtering equipment is simple,
and the rate is fast when sputtering metal. Rf sputtering is more
widely used, in addition to sputtering conductive materials, also
can sputter non-conductive materials, but also reactive sputtering
to prepare oxides, nitrogen and carbide and other compound
materials. If the frequency of radio frequency is increased, it
becomes microwave plasma sputtering. Now, the electron cyclotron
resonance (ECR) type microwave plasma sputtering is commonly used.
Features
1. Low density and high strength
2. Customized according to the drawings required by customers
3. Strong corrosion resistance
4. Strong heat resistance
5. Low temperature resistance
6. Heat resistance