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Evaporation Pellets φ2*5 Packaging Vacuum Packaging
Port of delivery | Xi'an port, Beijing port, Shanghai port, Guangzhou port, Shenzhen port |
Size | φ2*5 |
Packaging | Vacuum Packaging |
Vacuum Evaporation coating is a Vacuum coating method in which
evaporating material is heated by evaporator under Vacuum condition
and sublimated, evaporating particles flow directly into the
substrate and deposited on the substrate to form solid film, or
heating evaporating coating material.
The physical process is from material evaporation and transport to
substrate deposition and film forming. The physical process is as
follows: several energy methods are used to convert the material
into heat energy, and the material is heated to evaporate or
sublimate to become gaseous particles (atoms, molecules or
radicals) with a certain energy (0.1-0.3eV); After leaving the
plating surface, the gaseous particles with the same velocity are
transported to the substrate surface in a straight line with almost
no collision. The gaseous particles reaching the surface of the
matrix condense and nucleate into solid film. The atoms that make
up the film rearrange or form chemical bonds. [1]
Evaporative thermodynamics To escape from the surface of the plated
atoms or molecules in liquid or solid phase, sufficient heat energy
must be obtained and sufficient thermal motion must be obtained.
Only when the kinetic energy of the velocity component of its
vertical surface is sufficient to overcome the energy of mutual
attraction between atoms or molecules can it escape from the
surface and complete evaporation or sublimation. The higher the
heating temperature, the more kinetic energy the molecules have,
and the more particles vaporize or sublimate. Evaporation process
constantly consumes the internal energy of plating, to maintain
evaporation, it is necessary to continuously supply plating heat
energy. Obviously, during evaporation, the amount of vaporization
of the plating (as shown by the vapor pressure above the plating)
is closely related to the heating of the plating (temperature
rise). Therefore, the coating growth rate is closely related to the
evaporation rate of the plating material.
After the evaporation particles collide with the base material, one
part is reversed and the other part is absorbed. Surface diffusion
of adsorbed atoms occurs on the surface of the substrate, and
two-dimensional collisions occur between the deposited atoms,
forming clusters, some of which stay on the surface for a period of
time and then evaporate. Clusters of atoms collide with diffusing
atoms, adsorb or release single atoms, and the process repeats.
When the number of atoms exceeds a certain critical point, it
becomes a stable nucleus, and then continuously absorbs other and
compound atoms and gradually grows up. Finally, it merges with
neighboring stable nuclei and becomes a continuous film.
1. High specific strength (tensile strength/density)
2. Good strength
3. Better corrosion resistance performance in seawater, wet
chlorine and chloride solution
4. Good low-temperature performance
5. Low elastic modulus and thermal conductivity, Nonmagnetic
6. High hardness
7. Good thermal plasticity