2 Layer Solder Automotive PCB Assembly Mask 8mil Flexible Printed
Brand Name:Leadsintec
Certification:IATF16949, ISO13485, ISO9001
Model Number:PCBA
Minimum Order Quantity:1pcs
Delivery Time:1-30days
Payment Terms:L/C, T/T, D/A, D/P, Western Union
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Location:
Shenzhen China
Address:
4/F XingYuan Technology Park,Gushu Tongda Road ,Xixiang Town,Baoan District,Shenzhen,China,518102
Supplier`s last login times:
within 21 hours
Product Details
Company Profile
Product Details
2 Layer Solder Automotive PCB Assembly Mask 8mil Flexible Printed
Automotive PCB Assembly Contract Manufacturing 2 Layer Solder Mask Electronic PCBA
What Can LeadsintecDo?
Leadsintec is a professional PCB / PCBA Manufacturer in China, Shenzhen. With 20 years of development, FASPCBA turns into a first-class manufacturer of PCB / PCBA. From multi-layered to flexible printed circuit boards, Leadsintec is your one-stop-shop. We provide our customers with PCB Manufacturing, PCB Assembly, and Parts Sourcing services to save your time & cost.
Flex PCB Capability :
| Items | Type | Normal Manufacturing Capability |
| Standard Deliverable | Inspection Std. | IPC-6013 Class2, IPC-A-600G Class2 |
| Test Std. | IPC-TM-650,GB/T4677-2002 | |
| Material | DuPont | AL9111R, AP9121R, AP9131R, AP8525R |
| Panasonic | R-F775 11RB-M, R-F775 22RB-M, R-F775 21RB-M | |
| Taiflex | NDIR050513HJY,IDIR051013HJY,NDIR100520HJY,THK D200520JY | |
| Process capacity | Layers | 0-14 |
| Thickness | 0.07-4.0mm | |
| Max dimension | 10X18 Inch | |
| Min precision Of Dim | ±4mil | |
| Min diameter of holes | 4mil (Laser drill); 8mil(mechanical drill) | |
| Aspect ratio | 10:1 | |
Min trace width/sp ce outer layer(0.5OZ ) | 3.0/3.0mil | |
Min trace width/space outer layer(1OZ ) | 3.5/3.5mil | |
Min trace width/space outer layer(2OZ ) | 5/5mil | |
Min trace width/space inner layer(0.5OZ ) | 3.5/3.5mil | |
Min trace width/space inner layer(1OZ ) | 4/4mil | |
Min trace width/space wtidth of gridding circr | 5/5mil | |
Min trace width/space wtidth of out layer | 5/5mil(1/3,1/2oz copper)；6.5/5mil(1oz copper)； 8/5.5mil(2oz copper)； | |
Min distance Between drilling&conductor(via holes) | 7mil(2layers);9mil(3~6Llayers);11mil(≥7layers) | |
Min distance Between drilling&conductor(compon ent holes) | 10mil(2layers);12mil(3~6Llayers);14mil(≥7layers) |
Min distance Between drilling&conductor(buried &blind holes) | 7mil | |
Min ring of inner layer(via holes) | 5mil(≤6 Layers) ；8mil(＞8Layers) | |
Min ring of inner layer(component holes) | 8mil(≤6Layers) ；11mil(＞8Layers) | |
| The vias to the coalescent location of rigid and flex | 1mm | |
| HDI board | 1+n+1 | |
| Surface treatment | Plating Gold(Hard gold) | Normal:0.25-0.76um;Hard gold:0.76-2um； |
| ENIG | Ni:3--8um,Au:0.05-0.1um | |
| Immersion Tin | 0.80-1.20um | |
| Immersion Silver | 0.10-0.30um | |
| 0SP | 0.15-0.30um | |
| HASL | 2-40um | |
| HASL lead free | 2-40um | |
| Silver ink | 10-25um | |
| Selective surface finishing | ENIG+GOLD Finger; ENIG+HASL; ENIG+OSP; Soft gold+ GOLD Finger; Flash gold+HASL; immersion Tin+gold finger; Immersion sliver+gold finger; OSP +gold finger; Silver ink+Plating gold; Silver ink+ENIG. | |
| Min. bended radius | single side flex | 3-6 times the flex thickness |
| double sides flex | 6-10 times the flex thickness | |
| multi-layers flex | 10-15 times the flex thickness | |
| dynamic bending | 20-40 times the flex thickness |
Rigid-Flex PCB Capability :
| Items | Type | Normal Manufacturing Capability |
| Standard | Inspection Std. | IPC-6013 Class 2, IPC-A-600G Class 2, IPC-6013 Class 3 |
| Test Std. | IPC-TM-650,GB/T4677-2002 | |
| Material | DuPont | AL9111R, AP9121R, AP9131R, AP8525R |
| Panasonic | R-F775 11RB-M, R-F775 22RB-M, R-F775 21RB-M | |
| Taiflex | NDIR050513HJY,IDIR051013HJY,NDIR100520HJY,THKD200520 | |
| No Flow PP | VT-47N,VT-901 | |
| CCL | ITEQ IT180A , ShengYi 1000-2,N4000-13, Rogers4350B,4003C | |
| Process capacity | Layers | 2-20 |
| Thickness | 8-118mil | |
| Max dimension | 15.74X28 Inch | |
| Min precision Of Dim | ±4mil | |
| Min diameter of holes | 4mil (Laser drill); 6mil(mechanical drill) | |
| Aspect ratio | 16:1 | |
Min trace width/space wtidth of outer | 3.0/3.0mil | |
Min trace width/space wtidth of outer | 3.5/3.5mil | |
| wtidth of outer layer(2OZ finished | 5/5mil | |
Min trace width/space wtidth of inner | 3.5/3.5mil | |
Min trace width/space wtidth of out layer(1OZ | 4/4mil | |
| Min trace width/space wtidth of gridding circr | 5/5mil | |
Min trace width/space wtidth of out layer(2OZ finishedcopper,Flex layer on top or bottom) | 5/5mil(1/3,1/2oz copper)；6.5/5mil(1oz copper)；8/5.5mil (2oz copper)； | |
Min distance Between drilling&conductor(via holes) | 7mil(2layers);9mil(3~6Llayers);11mil(≥7layers) | |
Min distance Between drilling&conductor(com ponent holes) | 10mil(2layers);12mil(3~6Llayers);14mil(≥7layers) | |
Min distance Between drilling&conductor(burie d &blind holes) | 7mil | |
Min ring of inner layer(via holes) | 5mil(≤6 Layers) ；8mil(＞8Layers) |
Min ring of inner layer(component holes) | 8mil(≤6Layers) ；11mil(＞8Layers) | |
coalescent location of rigid and flex | 1mm | |
| HDI board | 1+n+1 | |
| Surface treatmen t | Plating Gold(Hard gold) | Normal:0.25-0.76um;Hard gold:0.76-2um； |
| ENIG | Ni:3--8um,Au:0.05-0.1um | |
| Immersion Tin | 0.80-1.20um | |
| Immersion Silver | 0.10-0.30um | |
| 0SP | 0.15-0.30um | |
| HASL | 2-40um | |
| HASL lead free | 2-40um | |
| Silver ink | 10-25um | |
| Selective surface finishing | ENIG+GOLD Finger; ENIG+HASL; ENIG+OSP; Soft gold+ GOLD Finger; Flash gold+HASL; immersion Tin+gold finger; Immersion sliver+gold finger; OSP +gold finger; Silver ink+Plating gold; Silver ink+ENIG. | |
| Routing | Outline Tol. | +/-4mil |
Leadsintec has been selected as the “excellent partner of the year” by numerous well-known enterprises, and won many domestic and authorized certifications at home and abroad, such as Chinese high-tech project certification, ISO9001, ISO14001, ISO13485, IATF16949 quality management system standard, and customized CE, UL, FCC, and other product certifications according to the customer's requirements.
100% PCB PCBA Testing:
Millions of circuit boards are produced here every year, which provides superior service for automotive electronics, medical electronics, power communications, industrial automation, military, aviation & aerospace, intelligent home, and other industries around the world. We will continue to improve our quality and service; customer satisfaction and the development of science and technology are our eternal motivation.
2 Layer Solder Automotive PCB Assembly Mask 8mil Flexible Printed
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