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Introduction to GaN on Silicon HEMT Epi wafer
Silicon based gallium nitride HEMT epitaxial wafer is a high
electron mobility transistor (HEMT) epitaxial wafer based on
gallium nitride (GaN) material. Its structure mainly includes AlGaN
barrier layer, GaN channel layer, AlN buffer layer, and silicon
substrate. This structure enables gallium nitride HEMTs to have
high electron mobility and saturation electron velocity, making
them suitable for high-power and high-frequency applications.
Structural characteristics
AlGaN/GaN Heterojunction: Gallium Nitride HEMT is based on
AlGaN/GaN heterojunction, which forms a high electron mobility
two-dimensional electron gas (2DEG) channel through the
heterojunction.
Depletion type and enhancement type: Gallium nitride HEMT epitaxial
wafers are divided into depletion type (D-mode) and enhancement
type (E-mode). Depleted type is the natural state of GaN power
devices, while enhanced type requires special processes to achieve.
Epitaxial growth process: Epitaxial growth includes AlN nucleation
layer, stress relaxation buffer layer, GaN channel layer, AlGaN
barrier layer, and GaN cap layer.
manufacturing process
Epitaxial growth: Growing one or more layers of gallium nitride
thin films on a silicon substrate to form high-quality epitaxial
wafers.
Passivation and cap layer: SiN passivation layer and u-GaN cap
layer are usually used on gallium nitride epitaxial wafers to
improve surface quality and protect the epitaxial wafers.
application area
High frequency applications: Due to the high electron mobility and
saturation electron velocity of gallium nitride materials, gallium
nitride HEMTs are suitable for high-frequency applications such as
5G communication, radar, and satellite communication.
High power applications: Gallium nitride HEMTs perform well in
high-voltage and high-power applications, suitable for fields such
as electric vehicles, solar inverters, and industrial power
supplies.
Product specifications
2inch GaN violet laser on silicon | ||||||||||
Item Si(111) substrates | nGaN | AlGaN | InGaN | MQW | InGaN | AlGaN | pGaN | Conntact layer | ||
InGaN-QW | GaN-QB | |||||||||
Dimensions | 2 inch | |||||||||
Thickness | 1000-1050nm | 1000-1020nm | 70-150nm | ~2.5nm | ~15nm | 70-150nm | 200-500nm | / | 10nm | |
Composition | Al% | / | 3-10 | / | / | / | / | 3-10 | / | / |
In% | / | / | 2-8 | ~10 | / | 2-8 | / | / | / | |
Doping | [Si] | 5.0E+8 | 2.0E+18 | 3.0E+18 | / | / | / | / | / | / |
[Mg] | / | / | / | / | / | / | 2.0E+19 | 2.0E+19 | / | |
IQE | Unknow | |||||||||
internal Loss | Unknown | |||||||||
Longueur d’onde laser | 405-420 nm | |||||||||
Lifetime | 10 seconds@CW, >10 hours@pulse mode | |||||||||
Substrate Structure | 10nmnConnect layer/pGaN/200-500nmAlGaN/70-150nmInGaN/~15nmGaN-QB/~2.5nmInGaN-QW/70-150nmInGaN/1000-1020nmAlGaN/1000-1050nmnGaN/Si(111)substrates | |||||||||
Peak Optical Power: | 30 mW@pulse mode | |||||||||
Package | Packaged in a class 100 clean room environment, in 25PCS container, under a nitrogen atmosphere |
About Us
We specialize in processing a variety of materials into wafers, substrates and customized optical glass parts.components widely used in electronics, optics, opto electronics and many other fields. We also have been working closely with many domestic and oversea universities, research institutions and companies, provide customized products and services for their R&D projects. It's our vision to maintaining a good relationship of cooperation with our all customers by our good reputations.
FAQ
Q: Are you trading company or manufacturer ?
We are factory.
Q: How long is your delivery time?
Generally it is 3-5 days if the goods are in stock.
or it is 7-10 days if the goods are not in stock, it is according
to quantity.
Q: Do you provide samples ? is it free or extra ?
Yes, we could offer the sample for free charge but do not pay the
cost of freight.
Q: What is your terms of payment ?
Payment <=5000USD, 100% in advance.
Paymen >=5000USD, 80% T/T in advance , balance before shippment.
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