8 inch Wafer Dicing Machine X Axis Cutting Range 260mm 1.8 KW 2.2 KW

DAD3350 Wafer Dicing Machine X-Axis Cutting Range 260mm 1.8 KW, 2.2 KW

Process quality

By adopting a high-rigidity bridge-type frame and a spindle front-section support structure, which prevents heat shrinkage and vibration, a more stable processing point can be achieved.

Process controls

Auto alignment, auto focus, auto kerf check, and other image recognition functions have been installed to improve equipment productivity. In addition, the microscope includes an air blow mechanism and a lens shutter to prevent contamination. As an option, a low magnification microscope can be added for rough alignment. Through condition monitoring the processing conditions and various other statuses can be known at any given time. Advanced process control features can be added as options, including an on-screen cutting water management system for cutting water flow control.

Specifications

* Product appearance, features, specifications, and other details may change due to technical modifications.
* Please read the standard specification sheet thoroughly before use.

Shanghai GaNova Electronic Information Co., Ltd. is a company specialized in broadband semiconductor technology related materials, equipment, testing and analysis services and technical advice. Founded in 2020, we are a wholly-owned subsidiary of Suzhou Nanowin Technology Co., Ltd. Our team has profound technological accumulation and rich customer resources in the semiconductor industry, and is committed to bringing value to the industrial chain through knowledge flow, technology flow and information flow, providing customers with high-quality and diversified optional product solutions and technical services.