XC3S1400A-4FGG484I Programming IC Chip Embedded FPGAs Logic Cells 1.26V
Brand Name:XILINX / AMD
Model Number:XC3S1400A-4FGG484I
Minimum Order Quantity:1
Delivery Time:1 - 3 days
Payment Terms:L/C, D/A, D/P, T/T, Western Union, MoneyGram
Place of Origin:original
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Shenzhen China
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1702, Dingcheng international building, Zhonghang Road, Futian District, Shenzhen
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Product Details
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Product Details
XC3S1400A-4FGG484I Programmable IC
Chip 484-BBGA Package Embedded FPGAs Integrated Circuits Logic
Cells
Number of LABs/CLBs | 2816 | |
Number of Logic Elements/Cells | 25344 | |
Total RAM Bits | 589824 | |
Number of I/O | 375 | |
Number of Gates | 1400000 | |
Voltage - Supply | 1.14V ~ 1.26V | |
Mounting Type | ||
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | ||
Supplier Device Package | 484-FBGA (23x23) | |
Base Product Number |
XC3S1400A-4FGG484I Features
• Very low cost, high-performance logic solution for
high-volume, cost-conscious applications
• Dual-range VCCAUX supply simplifies 3.3V-only design
• Suspend, Hibernate modes reduce system power
• Multi-voltage, multi-standard SelectIO™ interface pins
• Up to 502 I/O pins or 227 differential signal pairs
• LVCMOS, LVTTL, HSTL, and SSTL single-ended I/O
• 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling
• Selectable output drive, up to 24 mA per pin
• QUIETIO standard reduces I/O switching noise
• Full 3.3V ± 10% compatibility and hot swap compliance
• 640+ Mb/s data transfer rate per differential I/O
• LVDS, RSDS, mini-LVDS, HSTL/SSTL differential I/O with integrated
differential termination resistors
• Enhanced Double Data Rate (DDR) support
• DDR/DDR2 SDRAM support up to 400 Mb/s
• Fully compliant 32-/64-bit, 33/66 MHz PCI® technology support
• Abundant, flexible logic resources
• Densities up to 25,344 logic cells, including optional shift
register or distributed RAM support
• Efficient wide multiplexers, wide logic
• Fast look-ahead carry logic
• Enhanced 18 x 18 multipliers with optional pipeline
• IEEE 1149.1/1532 JTAG programming/debug port
• Hierarchical SelectRAM™ memory architecture
• Up to 576 Kbits of fast block RAM with byte write enables for
processor applications
• Up to 176 Kbits of efficient distributed RAM
• Up to eight Digital Clock Managers (DCMs)
• Clock skew elimination (delay locked loop)
• Frequency synthesis, multiplication, division
• High-resolution phase shifting
• Wide frequency range (5 MHz to over 320 MHz)
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XC3S1400A-4FGG484I Programming IC Chip Embedded FPGAs Logic Cells 1.26V
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