CY7C1356C-250AXC IC SRAM 9MBIT PAR 100TQFP Infineon Technologies

Brand Name:Infineon Technologies
Model Number:CY7C1356C-250AXC
Minimum Order Quantity:1
Delivery Time:3-5 work days
Payment Terms:T/T
Price:Based on current price
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Location: Shenzhen China
Address: No. 2520, 25th Floor, Block A, New Asia Guoli Building, Huaqiang North Street, Shenzhen, China
Supplier`s last login times: within 26 hours
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Product Details

Product Details


Functional Description

The CY7C1354A and CY7C1356A SRAMs are designed to eliminate dead cycles when transitioning from Read to Write or vice versa. These SRAMs are optimized for 100% bus utilization and achieve Zero Bus Latency™ (ZBL™)/No Bus Latency™ (NoBL™). They integrate 262,144 × 36 and 524,288 × 18 SRAM cells, respectively, with advanced synchronous peripheral circuitry and a two-bit counter for internal burst operation. These employ high-speed, low-power CMOS designs using advanced triple-layer polysilicon, double-layer metal technology. Each memory cell consists of four transistors and two high-valued resistors.

Features

• Zero Bus Latency™, no dead cycles between Write and Read cycles
• Fast clock speed: 200, 166, 133, 100 MHz
• Fast access time: 3.2, 3.6, 4.2, 5.0 ns
• Internally synchronized registered outputs eliminate the need to control OE
• Single 3.3V –5% and +5% power supply VCC
• Separate VCCQ for 3.3V or 2.5V I/O
• Single WEN (Read/Write) control pin
• Positive clock-edge triggered, address, data, and control signal registers for fully pipelined applications
• Interleaved or linear four-word burst capability
• Individual byte Write (BWa–BWd) control (may be tied LOW)
• CEN pin to enable clock and suspend operations
• Three chip enables for simple depth expansion
• Automatic power-down feature available using ZZ mode or CE select
• JTAG boundary scan
• Low-profile 119-bump, 14-mm × 22-mm BGA (Ball Grid Array), and 100-pin TQFP packages

Specifications

AttributeAttribute Value
ManufacturerCypress Semiconductor
Product CategoryMemory ICs
SeriesNoBL™
TypeSynchronous
PackagingTray Alternate Packaging
Unit-Weight0.023175 oz
Mounting-StyleSMD/SMT
Package-Case100-LQFP
Operating-Temperature0°C ~ 70°C (TA)
InterfaceParallel
Voltage-Supply3.135 V ~ 3.6 V
Supplier-Device-Package100-TQFP (14x20)
Memory Capacity9M (512K x 18)
Memory-TypeSRAM - Synchronous
Speed250MHz
Data-RateSDR
Access-Time2.8 ns
Format-MemoryRAM
Maximum Operating Temperature+ 70 C
Operating temperature range0 C
Interface-TypeParallel
Organization512 k x 18
Supply-Current-Max250 mA
Supply-Voltage-Max3.6 V
Supply-Voltage-Min3.135 V
Package-CaseTQFP-100
Maximum-Clock-Frequency250 MHz
Functional compatible componentForm,Package,Functional compatible component
Manufacturer Part#DescriptionManufacturerCompare
IDT71V65803S133PF
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CY7C1356A-133AC
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512KX18 ZBT SRAM, 4.2ns, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100Rochester Electronics LLCCY7C1356C-250AXC vs CY7C1356A-133AC
CY7C1356C-166AXC
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71V65803S133PFGI
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ZBT SRAM, 512KX18, 3.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100Cypress SemiconductorCY7C1356C-250AXC vs CY7C1356C-166AXI
IDT71V65803S133PFGI
Memory
ZBT SRAM, 512KX18, 4.2ns, CMOS, PQFP100, PLASTIC, MO-136, TQFP-100Integrated Device Technology IncCY7C1356C-250AXC vs IDT71V65803S133PFGI
71V65803S133PFG
Memory
TQFP-100, TrayIntegrated Device Technology IncCY7C1356C-250AXC vs 71V65803S133PFG
CY7C1356C-200AXI
Memory
ZBT SRAM, 512KX18, 3.2ns, CMOS, PQFP100, (14 X 20 X 1.4) MM, LEAD FREE, PLASTIC, TQFP-100Cypress SemiconductorCY7C1356C-250AXC vs CY7C1356C-200AXI
71V65803S133PFG8
Memory
TQFP-100, ReelIntegrated Device Technology IncCY7C1356C-250AXC vs 71V65803S133PFG8
IDT71V65803S133PFG
Memory
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Descriptions

SRAM - Synchronous Memory IC 9Mb (512K x 18) Parallel 250MHz 2.8ns 100-TQFP (14x20)
SRAM 9Mb 250Mhz 512K x 18 Pipelined SRAM
China CY7C1356C-250AXC IC SRAM 9MBIT PAR 100TQFP Infineon Technologies supplier

CY7C1356C-250AXC IC SRAM 9MBIT PAR 100TQFP Infineon Technologies

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