Optical Sony IMX586 VCM CMOS Camera Module For Drone And FPV

Optical Sony IMX586 VCM CMOS Camera Module For Drone And FPV

Specificaitons

Description

IMX586 is a diagonal 8.000 mm (Type 1/2.0) 48 Mega-pixel CMOS active pixel type stacked image sensor with a square pixel array. It adopts Sony's back-illuminated and stacked CMOS image sensor to achieve high speed image capturing by column parallel A/D converter circuits and high sensitivity and low noise image (comparing with conventional CMOS image sensor) through the backside illuminated imaging pixel structure. R, G, and B pigment primary color mosaic filter is employed. It operates with five power supply voltages: analog 2.9 V and 1.8V, digital 1.1 V, P L L-PHY 1.1V and 1.8 V for input/output interface and achieves low power consumption.

Features

◆Back-illuminated and stacked CMOS image sensor
◆Quad Bayer Coding color filter arrangement
◆Phase Detection Auto Focus (PDAF)
◆High Frame Rate 30fps@Full resolution (QBC Re-mosaic) / 30fps@QBC-HDR / 120fps@2x2 Adjacent Pixel Binning (16:9) / 240fps@2x2 Adjacent Pixel Binning V2H2(16:9)
◆High signal to noise ratio(SNR)
◆Dual sensor synchronization operation
◆Built-in 2D Dynamic Defect Pixel Correction
◆Lens Shading Correction (LSC)
◆Built-in temperature sensor
◆Output video format of RAW10/8, COMP8
◆QBC Re-mosaic function
◆QBC HDR function
◆Two PLLs for independent clock generation for pixel control and data output interface
◆CSI-2 serial data output MIPI D-PHY 2lane/4lane, Max. 2.5Gbps/lane, D-PHY spec. ver. 1.2 compliant MIPI C-PHY 1/2/3trio, Max 2.5Gsps/Trio, C-PHY spec ver. 1.0 compliant
◆2-wire serial communication (Supports I2C "Fast mode" and "Fast-mode Plus")
◆28K bit of OTP ROM for users

Device Structure

◆CMOS image sensor

◆Image size: Diagonal 8.000 mm (Type 1/2.0)

◆Total number of pixels: 8032 (H) × 6248 (V) approx. 50.18 M pixels

◆Number of effective pixels: 8032 (H) × 6088 (V) approx. 48.89 M pixel

◆Number of active pixels: 8000 (H) × 6000 (V) approx. 48.00 M pixels

◆Chip size : 7.504 mm (H) × 5.659 mm (V)

◆Unit cell size : 0.80 μm (H) × 0.80 μm (V)

◆Substrate material : Silicon

Applicaitons

Robots, Drones
Action Cameras
3D scanning applications
Field animal camera
Recording slow motion
Machine vision, etc.

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