10130248-006LF Power To The Board HPCE RA RECT 4HP2LP4HP2 RF Interconnects

Description

The High Power Card Edge (HPCE®) connector is a next generationpower card edge

connector for demanding applica-tions requiringhigh linear current density and low power loss.

HPCE offers a lowprofile height (7.50mm) and is based on very cost effective andhighly reliable

stamped-and-formed power contact technologysimilar to other power solutions from FCI.

HPCE® incorporates an innovative power contact and housingdesign that permits a more compact and

lower profile packagefor demanding AC and DC power supply and/or add-in cardapplications.

HPCE’s low profile height (for maximized airflow),significantly increased linear current density and low

contactresistance characteristics are ideal for next generation 1U/2Uservers, storage enclosures,

telecommunications equipment anddatacom/networking equipment.

HPCE® is available with power and signal contacts integrated intoa single molded housing for power

distribution and power control.Similar to other FCI power solutions, HPCE® is modularly tooledmaking

the product highly configurable in terms of the numberand placement of the power and signal contacts

for custom powerneeds.

HPCE® is rated to 9A per power contact beam (with multiple powercontacts fully energized) without

exceeding a 30°C temperaturerise in still air. The innovative design minimizes the connectorfootprint

and the robust housing includes touch-proof safetyfeatures as well as polarization to ensure proper

mating. Verticaland right angle and straddle mount options are available toaccommodate

various system architectures.

• Current rating to 9A/power contact beam (with multiple powercontacts fully energized) without

exceeding a 30°Ctemperature rise in still air

• Low profile height (2.8mm for straddle mount; 7.50mm for rightangle) maximizes airflow for effective

system cooling

• One-piece assembly enables cost-effective power deliveryfor 1U and 2U power supplies or power

distribution applications

• Highly vented housing design maximizes heat dissipation

• Vertical, right angle and straddle mount options are available withboth power contacts for power

distribution and signal contacts forpower control

• Number and placement of power and signal contacts are highlyconfigurable for custom power needs

TECHNICAL INFORMATION

MATERIALS

• Contacts: High performance Copper Alloy

• Contact Finish:

• Performance-based plating at separable interface(Telcordia GR-1217-CORE Central Office)

• Tin over Nickel on press-fit tails

• Tin-lead option

• Housings: High Performance Thermoplastic, 94-V0

• Plating GXT+™

ELECTRICAL PERFORMANCES

• Contact Resistance: ≤60 mΩ initial in backplaneapplication, ≤120 mΩ initial in coplanar application

• Current Rating (with ≤30°C temperature rise aboveambient): 0.5 A/contact with all contacts powered

• Insertion Loss Performance: see graph below

• Crosstalk Performance: see graph belowENVIRONMENTAL

• Telcordia GR-1217-CORE Central Office qualification passedMECHANICAL PERFORMANCE

• Durability: 200 cycles• Mating Force: 0.50N max./contact

• Unmating Force: 0.15N min./contact• Average Compliant Pin Insertion Force/pin:

• 0.4mm PCB hole: 15N max.

• 0.5mm PCB hole: 30N max.

• Polarized housing option ensures proper mating board orientation

• Plastic housing features and mounting ear options are availablefor polarization to the host PCB

as well as to secure the connectorduring the wave solder process

TARGET MARKETS/APPLICATIONS

• AC/DC pluggable power supplies in data, telecom &datacom/networking equipment

• Industrial PCs

• Industrial controls & instrumentation

• Medical