10136590-101LF High Speed Modular Connectors VS2 3X8 RH SM 1S/G RF Interconnects
Brand Name:Amphenol ICC (FCI)
Model Number:10136590-101LF
Minimum Order Quantity:1pcs
Delivery Time:1day
Payment Terms:T/T, Western Union
Place of Origin:CHN
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Product Details
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Product Details
10136590-101LFHigh Speed / Modular Connectors VS2 3X8 RH SM 1S/G
| Amphenol | |
| Product Category: | High Speed / Modular Connectors |
| 72 Position | |
| 9 Row | |
| 2 mm | |
| Press Fit | |
| PwrBlade | |
| Bulk | |
| Brand: | Amphenol FCI |
| Contact Material: | Copper Alloy |
| Housing Material: | Thermoplastic (TP) |
| Mounting Angle: | Right Angle |
| Product Type: | High Speed / Modular Connectors |
| Subcategory: | Backplane Connectors |
| Tradename: | PwrBlade |
Description
AirMax VS2® connectors provide a migration path from AirMaxVS® for speeds up to 20Gb/s, providing
margin of safety fortypical 802.3ap system performance with the flexibility ofan open pin field design.
The connectors leverage AirMax VS®and VSe® design features and technology to achieve improvedsignal
integrity and mechanical attributes compared to AirMaxVS® connectors.
The connector utilizes FCI technology for a shieldless designwith no metallic plates and closely coupled
differential pairdesign to yield low loss and low crosstalk.AirMax VS2® connectors are mating-compatible
to both AirMaxVS® and AirMax VSe® connectors and require no changes toconnector PCB footprints.
The mating-compatible interfacesand capability to preserve critical pin assignments can provide opportunities
for cost savings as new and upgraded equipmentis deployed. For example, a backplane or chassis can
bedesigned to allow the installation and continued use of legacydaughter cards, line cards, or blades that
are already in thefield as well as new or future higher-speed module cards.Right angle and vertical
receptacles and headers supportbackplane, midplane and coplanar applications.
FEATURES
●Provides a migration path to 20Gb/s per differential pair
●Shieldless design with closely coupled pairs
●Backward mateable to existing VS andVS2 designs
●3, 4 and 5 pair backplane and coplanar versions are available
●Available with 0.5mm or 0.4mm compliant pins
●Hard metric design practice
BENEFITS
●Enables users to upgrade systems for higher performance in the
same form factor
●Cost-effective solution yields low XT and Insertion Loss
●Drop in upgrade to previous generation systems
●Same product covers a wide range of customer applications
●0.5mm vias provide a drop-in replacement forVS parts
●Improved SI with the 0.4mm tails, same as V5e
●Can mix-and-match with other metric power and guidance components
to create the precise system
configuration that is needed
TECHNICAL INFORMATION
MATERIALS
• Contacts: High performance Copper Alloy
• Contact Finish:
• Performance-based plating at separable interface(Telcordia GR-1217-CORE Central Office)
• Tin over Nickel on press-fit tails
• Tin-lead option
• Housings: High Performance Thermoplastic, 94-V0
• Plating GXT+™
ELECTRICAL PERFORMANCES
• Contact Resistance: ≤60 mΩ initial in backplaneapplication, ≤120 mΩ initial in coplanar application
• Current Rating (with ≤30°C temperature rise aboveambient): 0.5 A/contact with all contacts powered
• Insertion Loss Performance: see graph below
• Crosstalk Performance: see graph belowENVIRONMENTAL
• Telcordia GR-1217-CORE Central Office qualification passedMECHANICAL PERFORMANCE
• Durability: 200 cycles• Mating Force: 0.50N max./contact
• Unmating Force: 0.15N min./contact• Average Compliant Pin Insertion Force/pin:
• 0.4mm PCB hole: 15N max.
• 0.5mm PCB hole: 30N max.
10136590-101LF High Speed Modular Connectors VS2 3X8 RH SM 1S/G RF Interconnects
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