Wafer Foam Of Different Thicknesses Is Used In Wafer Carrier To Cushion And Protect Wafer
Brand Name:Hiner-pack
Certification:ISO 9001 ROHS
Model Number:HWS-HN100~200mm-Round Foam
Minimum Order Quantity:500PCS（Negotiable）
Delivery Time:1~2 Weeks
Payment Terms:100% Prepayment
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Shenzhen China
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Building A11,Zone D,West Industrial Zone,Minzhu Community, Shajing Street,Baoan District,Shenzhen City,GD Province CN
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Wafer Foam Of Different Thicknesses Is Used In Wafer Carrier To
Cushion And Protect Wafer
wafer foam separator is a specialized component used in the semiconductor manufacturing process, particularly in the handling and packaging of wafers. Here are some key points about it:
Purpose: The primary function of a wafer foam separator is to protect wafers from physical damage and contamination during transport and storage. It provides cushioning and prevents direct contact betweenwafers.
Material: Typically made from soft, flexible foam materials, these separators can absorb shocks and vibrations, which helps in maintaining the integrity of delicate silicon wafers.
Design: The separators are designed to fit between individual wafers, often with cutouts or grooves that accommodate the specific dimensions of the wafers, ensuring a snug fit.
Applications: Wafer foam separators are commonly used in various stages of semiconductor fabrication, including during the transport between different processing steps, as well as in storage and shipping containers.
Benefits: Using wafer foam separators reduces the risk of scratches, chips, and other types of damage that can occur during handling, ultimately improving yield and reliability in semiconductor products.
Overall, wafer foam separators play a crucial role in ensuring the safe handling of semiconductor wafers throughout the manufacturing process.
Parameter | Value |
|---|---|
Material | Antistatic Polyethylene |
Origin | China |
Breathability | High |
Durability | High |
Property | Avoid Corrosion |
Property*2 | Good Shock Resistance |
Surface Resistance*1 | 1.0*10E4~1.0*10E11Ω |
Shape | Round |
Size | 4~12 Inch/100~300mm |
Property*1 | No Organic Pollution |
Key Features | Description |
|---|---|
Color | Pink |
Placement | Horizontally In The Wafer Shipper |
Shock Absorption | Provides cushioning and protection against shocks |
Wafer Foam Of Different Thicknesses Is Used In Wafer Carrier To Cushion And Protect Wafer
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