Component Reliability Improvement Certification for Electronic Components
Brand Name:null
Certification:Failure analysis of electronic components
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Shenzhen China
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101, 201 Building A and 301 Building C, Juji Industrial Park, Yabianxueziwei Shajing Street, Baoan District, Shenzhen, 518000, China
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Failure analysis of electronic components
Basic introduction
The rapid development of electronic component technology and the
improvement of reliability have laid the foundation for modern
electronic equipment. The fundamental task of component reliability
work is to improve the reliability of components. Therefore, it is
necessary to attach importance to and accelerate the development of
component reliability analysis work, determine the failure
mechanism through analysis, find out the cause of failure, and
feedback to design, manufacturing and use, jointly study and
implement corrective measures to improve the reliability of
electronic components.
The purpose of failure analysis of electronic components is to
confirm the failure phenomenon of electronic components with the
help of various test analysis techniques and analysis procedures,
distinguish their failure mode and failure mechanism, confirm the
final cause of failure, and put forward suggestions for improving
design and manufacturing processes to prevent the recurrence of
failure and improve component reliability.
Service objects
Component manufacturers: deeply involved in product design,
production, reliability testing, after-sales and other stages, and
provide customers with theoretical basis for improving product
design and process.
Assembly plant: divide responsibilities and provide basis for
claims; improve production process; screen component suppliers;
improve testing technology; improve circuit design.
Device agent: distinguish quality responsibility and provide basis
for claims.
Machine users: Provide a basis for improving the operating
environment and operating procedures, improve product reliability,
establish corporate brand image, and improve product
competitiveness.
Significance of failure analysis
1. Provide a basis for electronic component design and process
improvement, and guide the direction of product reliability work;
2. Identify the root causes of electronic component failure, and
effectively propose and implement reliability improvement measures;
3. Improve the yield rate and reliability of finished products, and
enhance the core competitiveness of the enterprise;
4. Clarify the responsible party for product failure and provide a
basis for judicial arbitration.
Types of components analyzed
Integrated circuits, field effect tubes, diodes, light-emitting
diodes, triodes, thyristors, resistors, capacitors, inductors,
relays, connectors, optocouplers, crystal oscillators and other
active/passive devices.
Main failure modes (but not limited to)
Open circuit, short circuit, burnout, leakage, functional failure,
electrical parameter drift, unstable failure, etc.
Common failure analysis techniques
Electrical testing:
Connectivity test
Electrical parameter test
Function test
Non-destructive analysis technology:
X-ray perspective technology
Three-dimensional perspective technology
Reflection scanning acoustic microscopy (C-SAM)
Sample preparation technology:
Opening technology (mechanical opening, chemical opening, laser
opening)
Passivation layer removal technology (chemical corrosion removal,
plasma corrosion removal, mechanical grinding removal)
Micro-area analysis technology (FIB, CP)
Microscopic morphology technology:
Optical microscopic analysis technology
Scanning electron microscope secondary electron image technology
Failure location technology:
Microscopic infrared thermal imaging technology (hot spot and
temperature mapping)
Liquid crystal hot spot detection technology
Emission microscopic analysis technology (EMMI)
Surface element analysis:
Scanning electron microscopy and energy spectrum analysis (SEM/EDS)
Auger electron spectroscopy (AES)
X-ray photoelectron spectroscopy (XPS)
Secondary ion mass spectrometry (SIMS)
Component Reliability Improvement Certification for Electronic Components
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