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1206 Multilayer Chip Varistor SV1206N220G0A For Motherboard Notebook

1206 Multilayer Chip Varistor SV1206N220G0A For Motherboard Notebook

Brand Name:SOCAY
Certification:REACH RoHS ISO
Model Number:SV1206N220G0A
Minimum Order Quantity:3000PCS
Delivery Time:5-8 work days
Place of Origin:Shenzhen Guangdong China
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Location: Shenzhen Guangdong China
Address: 4/F, Block C, HeHengXing Science & Technology Park, 19 MinQing Road, LongHua District, Shenzhen City, GuangDong Province, China
Supplier`s last login times: within 40 hours
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1206 Multilayer Chip Varistor SV1206N220G0A Application for Mother Board, Notebook


Multilayer Chip Varistor DATASHEET: SV1206N220G0A_v209.1.pdf


Description:
The Multilayer Chip Varistor SV1206N220G0A is based on Multilayer fabrication technology. These components are designed to suppress a variety of transient events, including those specified in IEC 61000-4-2 or other standards used for Electromagnetic Compliance (EMC). The SV1206N220G0A is typically applied to protect integrated circuits and other components at the circuit board level. It can operate over a wider temperature range than zener diodes.


Multilayer Chip Varistor Electrical Characteristics (25±5℃):

SymbolMinimumTypicalMaximumUnits
VRMS17V
VDC22V
VV26.433V
VC72V
Imax100A
Wmax0.5W

VRMS - Maximum AC operating voltage the varistor can maintain and not exceed 10μA leakage current.

VDC - Maximum DC operating voltage the varistor can maintain and not exceed 10μA leakage current.

VV - Voltage across the device measure at 1mA DC current.

Equivalent to VB “breakdown voltage”.

VC - Maximum peak current across the varistor with 8/20μs waveform and 5A pulse current.

Imax - Maximum peak current which may be applied with 8/20μs waveform without device failure.

Wmax - Maximum energy which may be dissipated with the 10/1000μs waveform without device failure.




Multilayer Chip Varistor Features:

  • Rectangle, sizes serialization for hybrid integrated circuit or printed circuit surface mount components
  • There are many side electrode lead-out material, particularly suitable for surface mount technology for solderability and resistance to soldering heat of the stringent requirements
  • Fast response (<1ns)
  • Low leakage current, low clamping voltage
  • Suitable for reflow, wave soldering and hot air hand soldering



Multilayer Chip Varistor Applications:

  • Application for Mother Board, Notebook, Cellular Phone, PDA, handheld device, DSC, DV, Scanner, and Set- Top Box…etc.
  • Suitable for Push-Button, Power Line and Low Frequency single line over-voltage protect.




Multilayer Chip Varistor Construction & Dimensions:

Size EIA (EIAJ)Length (L)Width (W)Thickness (T)
InchesMillimetersInchesMillimetersInchesMillimeters
1206 (3216)0.126±0.0123.20±0.300.063±0.0121.60±0.300.071 Max1.80 Max



Multilayer Chip Varistor IR Soldering:


Rapid heating, partial heating or rapid cooling will easily cause defect of the component. So preheating and gradual cooling process is suggested. IR soldering has the highest yields due to controlled heating rates and solder liquidus times. Make sure that the element is not subjected to a thermal gradient steeper than 4 degrees per second. 2 degrees per second is the ideal gradient. During the soldering process, pre-heating to within 100 degrees of the solder peak temperature is essential to minimize thermal shock.



Soldering Recommendations:

  • Preheat
    • The temperature rising speed is suggested to be 2~4 ℃ /s
    • Appropriate preheat time will be from 60 to 120 seconds.
  • Heating
    • Careful about sudden rise in temperture as it may worser the solder ability.
    • Set the peal temperature in the range from 215 ℃ to 225 ℃.
  • Cooling
    • Careful about slow cooling as it may cause the position shift of component.



Multilayer Chip Varistor Environmental & Reliability Testing:

CharacteristicTest method and description
High Temperature StorageThe specimen shall be subjected to125±2℃ for 1000±2 hours in a thermostatic bath without load and then stored at room temperature and humidity for 1 to 2 hours. The change of varistor voltage shall be within 10%.
Temperature CycleThe temperature cycle of specified temperature shall be repeated five times and then stored at room temperature and humidity for one two hours. The change of varistor voltage shall be within 10% and mechanical damage shall be examined.StepTemperturePeriod
1-40±3℃30min±3
2Room Temperature1~2hours
3125±2℃30min±3
4Room Temperature1~2hours
High Temperature LoadAfter being continuously applied the maximum allowable voltage at 85℃ for 1000hours, the specimen shall be stored at room temperature and humidity for one or hours, the change of varistor voltage shall be within 10%.

Damp Heat Load/

Humidity Load

The specimen should be subjected to 40℃,90 to 95%RH environment, and the maximum allowable voltage applied for 1000 hours, then stored at room temperature and humidity for one or two hours. The change of varistor voltage shall be within 10%.
Low Temperature StorageThe specimen should be subjected to -40℃, without load for 1000 hours and then stored at room temperature for one two hours. The change of varistor voltage shall be within 10%.





Quantity of Products in The Taping Package:

SIZE EIA (EIAJ)

1206

(3216)

Standard Packing Quantity (PCS / reel)3,000

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1206 Multilayer Chip Varistor SV1206N220G0A For Motherboard Notebook

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