Product Details
Automatic Molding Press Machine
Features
● Automatic molding press also known as automatic molding machine,
automatic molding chips, semiconductor devices and other products;
● Full servo control system, PLC (Omron) + controller;
● Standardized mold structure, easy to change;
● High efficiency cake loading component, aluminum box loading;
● WIN10 + 15 inch touch screen + touch keyboard;
● CCD image detection, feeding anti-reverse detection;
● Optional mold vacuum function, isolation mold function, detection
function after plastic sealing;
Technical Parameters:
Type | Vertical Injection Molding Machine |
Control System | PLC |
Model | SM-1000 |
Cooling System | Water |
Weight | 5 Tons |
Clamping Force | 1000KN |
Capacity | 100 Tons |
Screw Diameter | 35 Mm |
Max. Mold Height | 400Mm |
Injection Pressure | 200 Mpa |
Auto Transfer Molding | Yes |
Auto Packaging Equipment | Yes
|
Performance Parameters
● Mold closing pressure: 98-1764kN;
● Injection pressure: 4.9-30kN adjustable;
● Applicable leadframe/substrate size: width 20-90mm, length
100-300mm, thickness 0.15-1.2mm;
● Applicable molding material size: diameter φ 11-20mm,
length/diameter 1.2-2.0 (Max 35mm).
Company Profile
Our company is a leading enterprise in China that has long been
committed to the R & D, production, manufacturing and sales of
the semiconductor's leading frame mold and (integrated circuit IC)
the post-process packaging equipment .
As a professional semiconductor packaging equipment company, we
have advanced production equipment and technical teams that can be
customized according to customer needs.
In terms of foreign trade development, we have rich experience and
wide customer network. In the 13 years since the establishment of
the company, our products have been successfully exported to more
than 50 countries and regions such as Russia, France, Germany,
Japan, the United States, Brazil, India, Thailand, Hong Kong,
Malaysia, and Saudi Arabia and have received the unanimous praise
from global customers.
We make a series of molds required to include the IC lead frame,
Transfer Molding, Trim & Form System and other semiconductor's
post—processes. Whether it is semiconductor separate devices,
capacitors, inductors, resistors, bridge circuits, vehicle
electrons, etc., or the LED industry, the LED industry's MicroLED
& miniled solid and liquid packaging. We not only provide a
plan for your newly developed products, but also provide
suggestions from the aspects of improving product quality and
improving costs for the products that exist in production.
If you are interested it, we can talk in detail and look forward to
cooperating with you.