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Automatic Semiconductor Molding Press Machine

Automatic Semiconductor Molding Press Machine

Brand Name:TJIN
Certification:ISO9001
Minimum Order Quantity:1 set
Delivery Time:40 days
Place of Origin:China
Packaging Details:Wooden Packing
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Location: Dongguan Guangdong China
Address: No. 3 Xialian Road, Chang'an Town, Dongguan City, Guangdong Province, China
Supplier`s last login times: within 48 hours
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Product Details

Automatic Molding Press Machine


Features

● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products;

● Full servo control system, PLC (Omron) + controller;

● Standardized mold structure, easy to change;

● High efficiency cake loading component, aluminum box loading;

● WIN10 + 15 inch touch screen + touch keyboard;

● CCD image detection, feeding anti-reverse detection;

● Optional mold vacuum function, isolation mold function, detection function after plastic sealing;


Technical Parameters:

TypeVertical Injection Molding Machine
Control SystemPLC
ModelSM-1000
Cooling SystemWater
Weight5 Tons
Clamping Force1000KN
Capacity100 Tons
Screw Diameter35 Mm
Max. Mold Height400Mm
Injection Pressure200 Mpa
Auto Transfer MoldingYes
Auto Packaging EquipmentYes

Performance Parameters

● Mold closing pressure: 98-1764kN;

● Injection pressure: 4.9-30kN adjustable;

● Applicable leadframe/substrate size: width 20-90mm, length 100-300mm, thickness 0.15-1.2mm;

● Applicable molding material size: diameter φ 11-20mm, length/diameter 1.2-2.0 (Max 35mm).

China Automatic Semiconductor Molding Press Machine supplier

Automatic Semiconductor Molding Press Machine

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