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Form factor | Tower or 4U Rack |
Processor | One or two third-generation Intel Xeon Scalable processor (formerly
codenamed "Ice Lake"). Supports processors up to 36 cores, core
speeds of up to 3.6 GHz, and TDP ratings of up to 250W. |
Memory | 32 DIMM slots with two processors (16 DIMM slots per processor).
Each processor has 8 memory channels, with 2 DIMMs per channel
(DPC). Lenovo TruDDR4 RDIMMs and 3DS RDIMMs are supported. DIMM
slots are shared between standard system memory and persistent
memory. DIMMs operate at up to 3200 MHz at 2 DPC. |
Disk drive bays | 2.5-inch drive bays: * Up to 32x 2.5-inch hot-swap bays (16x NVMe) plus 2x 5.25-inch media bays 3.5-inch drive bays: * Up to 16x 3.5-inch hot-swap bays (8x NVMe) (no media bays) * Up to 12x 3.5-inch hot-swap bays (8x NVMe) plus 2x 5.25-inch media bays * Up to 12x 3.5-inch simple-swap bays plus 2x 5.25-inch media bays Internal drives for OS boot or drive storage: * Internal M.2 module supporting up to two M.2 drives |
Network interfaces | Two onboard 10GBASE-T Ethernet RJ45 ports based on a Broadcom
BCM57416 controller. Additional dedicated Gigabit port for remote
management via the XClarity Controller (XCC) management processor. |
GPU support | Supports up to 8x single-wide GPUs or up to 4x double-wide GPUs |
Power supply | Up to two hot-swap redundant AC power supplies, 80 PLUS Platinum or
80 PLUS Titanium certification. 750 W, 1100 W, 1800 W and 2400W AC
options, supporting 220 V AC. 750 W and 1100 W options also support
110V input supply. In China only, all power supply options support
240 V DC. |