GS600SU GS600SUA Underfill Dispensing Machine for Die Form Underfill FCBGA FCCSP SIP Packaging CUF Application
Brand Name:MingSeal
Certification:CE/ISO
Model Number:GS600SU
Minimum Order Quantity:1
Delivery Time:5-60 days
Payment Terms:L/C, T/T, D/A, D/P, MoneyGram, Western Union
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Location:
Changzhou Jiangsu China
Address:
No. 18-98, Changwu Middle Road, Wujin District, Changzhou City, Jiangsu Province
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Product Details
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Product Details
GS600SU Underfill Dispensing Machine
for Die Form Underfi ll
GS600 SU is a high- speed and high- precision automatic online dispensing system which is developed based on Underfill process requirements of FCBGA/FCCSP.
The system strictly controls the product and adhesive temperature,
and intelligently sorts the product operation sequence and the glue
replenishment time, reducing the generation of voids and ensuring
the operation yield. Meanwhile, it is compatible with international
semiconductor communication protocols, and matches the infor-
mation management requirements.
■ Application Fields
FCBGA Packaging CUF Application FCCSP Packaging CUF Application SiP
Packaging CUF Application
■ Technical Specifications
| Application Fields | FCBGA, FCCSP, SIP | |
| Applicable Process | Die Form Underfill | |
| Cleanliness Level | Cleanliness of working area | Class 100 (Class 1000 workshop) Class 10 (Class 100 workshop) |
Transmission Mechanism | Transmission system | X/Y:Linear motor Z: Servo motor&Screw module |
| Repeatability (3sigma) | X/Y: ±0.003mm, Z: ±0.005mm | |
| Positioning accuracy (3sigma) | X/Y: ±0.010mm, Z: ±0.015mm | |
| Max. movement speed | X/Y: 1000mm/s | |
| Z: 500mm/s | ||
| Max. accelerated velocity | X/Y: 1g, Z: 0.5g | |
| Grating resolution | 1 μ m | |
| Z axis movement range(W× D) | 3 5 0 mm×4 7 0mm | |
| Z axis height calibration & compensation Method | Laser sensor (Laser sensor) | |
| Laser sensor accuracy | 2μ m | |
Dispensing System | Glue control accuracy | ± 3 % / 1mg |
| Single dot position repeatability CPK＞1.0 | ±25 μ m | |
| Min. nozzle diameter | 30 μ m | |
| Min. single dot glue weight | 0 .001mg/dot | |
| Max. fluid viscosity | 200000cps | |
| Max. jetting frequency | 1000Hz | |
| Runner/nozzle heating temperature | Room temperature~200℃ | |
| Runner/nozzle heating temp. deviation | ± 2 ℃ | |
| Applicable adhesive packaging spec. | 5CC/10CC/30CC/50CC/70CC | |
| Syringe cooling range | Cools down to 15°C below ambient temp. | |
| Piezo cooling range | Cools down to compressed air source temp. | |
Track System | Number of tracks | 2 |
| Number of belt sections | One piece | |
| Max. track transmission speed | 300mm/s | |
| Max. track transmission weight | 3kg | |
| Minimum edge clearance | 3 mm | |
| Track width adjustment range | 60mm~ 162mm Adjustable | |
| Track width adjustment Method | Manual | |
| Track height | 910mm~960mm Adjustable | |
| Max. thickness of applicable substrate/carrier | 6 mm | |
| Applicable substrate/carrier length range | 60mm-325mm | |
| Vacuum suction pressure Range | -50~-80Kpa Adjustable | |
| Bottom heating temperature range | Room temperature~180℃ | |
| Bottom heating temp. deviation | ≤ ± 1 . 5 ℃ | |
Facilities | Footpri nt W× D× H | 2380mm*1550mm*2080mm(Loading&Unloading& display included) |
| 2380mm*1200mm*2080mm(Loading&Unloading included, display excluded) | ||
| Weight | 1600kg | |
| Power supply | 200~240VAC,47~63HZ (Single-phase voltage adaptation power supply) | |
| Electric current | 30A | |
| Power | 6.4KW | |
| Inhale | (0.5Mpa, 450L/min) ×2 | |
- FCBGA Packaging CUF Application
- FCCSP Packaging CUF Application
- SiP Packaging CUF Application
Special Process Modules
CUF Special Piezoelectric Jetting System
Adhesive insulation + piezoelectric ceramic temperature closed-loop control to avoid system instability caused by temperature influenceTriple Low-level Alarm
Capacitive detection + magnetic detection + system weighing to avoid poor operation caused by lack of glueVacuum Adsorption Heating Fixture
The temperature difference of the whole surface of the fixture is ≤ ±1.5°C, and the temperature is monitored and compensated in real time to avoid poor operation caused by product temperature variation during operationPress-Down Track
The vacuum adsorption fixture always keeps still, and the track moves up and down to avoid poor operation caused by loss of flatness during reciprocating movement of the vacuum adsorption fixture.Platform-Type Loading & Unloading System
The feeding sequence is automatically sorted, and the operation is completed within the Plasma time limit
Friendly human-machine interface designVisual system
Positioning and detection functions
Inspection before operation to avoid defective incoming materials
Inspection after operation to prevent batch defects
GS600SU GS600SUA Underfill Dispensing Machine for Die Form Underfill FCBGA FCCSP SIP Packaging CUF Application
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