GS600SW Wafer-Level Dispensing Machine RDL First WLP CUF Application
Brand Name:MingSeal
Certification:ISO CE
Model Number:GS600SW
Minimum Order Quantity:1
Delivery Time:5-60 days
Payment Terms:L/C, T/T, D/A, D/P, MoneyGram, Western Union
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Changzhou Jiangsu China
Address:
No. 18-98, Changwu Middle Road, Wujin District, Changzhou City, Jiangsu Province
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Product Details
SS101 Wafer-Level Dispensing Machine
For Wafer Form Underfill
SS101 is a highly stable and precise wafer level dispensing system which is developed based on Under fill process requirements of RDL First WLP.
The equipment meets the needs of the semiconductor industry,can be provided with an automatic wafer loading & unloading system , and can automatically realize functions such as wafer handling , alignment , preheating , operation heating and heat dissipation . It is compatible with international semiconductor communication protocols , and is provided with an AMHS automatic loading & unloading robot interface to match the
information management requirements and unmanned management trends.
SS101 System Layout
➀ Loadport & Foup
➁ Aligner
➂ QR code scanning station
➃ Pre-heating station
➄Heat dissipation station
➅GS600SWA Dispensing Machine work station ➆GS600SWB Dispensing Machine work station
➇Robot Handling module
Composition of SS101 Wafer-Level Dispensing System
- GS600SW wafer-level dispensing machine × 2
- PC101 wafer loading & unloading machine × 1
Application Fields
- RDL First WLP
- CUF Application
SS101 Wafer-Level Dispensing Operation Flow
Features and Advantages
- Supporting 8/12-inch wafer dispensing.
- Dustproof level 10, meeting the environmental requirements of wafer level packaging.
- ESD protection meeting international IEC and ANSI standards.
- In the whole process of wafer turnover and operation, the temperature is finely controlled and automatically corrected to meet the CUF process requirements while ensuring the product safety.
- The whole-process video monitoring facilitates product turnover, operation process observation, and problem tracing and analysis
Technical Specifications
| SS101 system | GS600SWA * 1 ,GS600SWB * 1, PC101 Wafer Handling Machine * 1 (EFEM) | |
| Application Fields | RDL First WLP, CUFApplication | |
| Cleanliness Level | Cleanliness of working area | Class 100 (Class 1000 workshop) Class 10 (Class 100 workshop) |
Product Application Fields | Support for wafer size | φ200mm±0 .5mm, φ300mm±0.5mm (Standard model supports 12-inch wafers only) |
| Support for wafer thickness | 300-2550μ m | |
| Allowable wafer max. warpage range | ＜5mm (as per Robot Finger type) | |
| Allowable max.wafer weight | 600g (as per Robot Finger type) | |
| Wafer cassette form | 8 inches Open Cassette,12 inches Foup (Standard model supports 12-inch wafers only) | |
PC101(EFEM) | Loading&unloading method | Loadport+Robots |
| Pre-Aligner accuracy | Round center correction deviation≤±0 . 1mm； Angle correction deviation≤±0 .2 ° | |
| Wafer reader | Supports SEMI fonts (Flat or concave/convex surfaces) ,non-SEMI fonts | |
| Preheating temp. range | Room temperature~180℃ | |
| Wafer cooling method | Natural cooling or air cooling | |
Dispensing Motion System | Transmission mechanisms | X/Y: Linear motor Z: Servo motor&Screw module |
| Repeatability | X/Y: ±3μ mZ: ±5μ m | |
| Positioning accuracy | X/Y: ±10μ m | |
| Max. movement speed | X/Y: 1000mm/s Z: 500mm/s | |
| Max. accelerated velocity | X/Y: 1g Z: 0 .5g | |
Vision System | Camera pixels | 130W |
| Recognition accuracy | ±1 Pixel | |
| Recognition range | 12 × 16mm＜Recognition range＜19 .2 ×25 .6mm | |
| Light source | Combined three-color light source red, green, white + red | |
| Weighing Calibration System | Weighing accuracy | 0.01mg |
Chuck Table Load Tray | Vacuum surface flatness deviation | ≤ 3 0 um |
| Heating temp.range | Room temperature~180℃ | |
| Heating temp. deviation | ≤ ± 1 . 5 ℃ | |
| Repeatability of lifting height | ±10 μ m | |
| Vacuum suction pressure | -70~-85Kpa Settable | |
Facilities | Footprint (W*D*H) | 3075×2200×2200mm(Display unfolded) |
| Weight | 2.9t | |
| Power supply | 200~240VAC,47~63HZ (Single-phase voltage adaptation power supply) | |
| Electric current | 75A | |
| Power | 16.5KW | |
| Inhale | (0.5Mpa, 450L/min) ×5 way | |
| Operating ambient temp. | 23℃±3℃ | |
| Relative humidity of working environment | 30 ~ 70% | |
GS600SW Wafer-Level Dispensing Machine RDL First WLP CUF Application
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