D&H LED Solution Modular GOB Bonding Equipment Energy Saving Design For LED / Electronics Industry
Brand Name:D&H
Certification:ce
Model Number:GOB
Minimum Order Quantity:1
Place of Origin:CHINA
Packaging Details:standard wood case
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Location:
Guangzhou Guangdong China
Address:
Room 402, 4th Floor, Building B3, Liandong U Valley Huangpu Science and Technology Headquarters Port, No. 9, Xicheng South Street, Huangpu District, Guangzhou City, Guangdong Province.
Supplier`s last login times:
within 18 hours
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Product Details
D&H GOB Lamination Production Line
——Tailored Solutions for Precision LED Manufacturing
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Overview
The D&H GOB (Glue on Board) Encapsulation Production Line offers fully customization solutions to meet diverse industrial needs, combining advanced encapsulation technology with modular design. Our production line prioritizes flexibility, enabling adjustment in size, mold configurations, software integration, and process parameters to align with specific client requirements.
1. Production Line Dimensions
——Tailored Solutions for Precision LED Manufacturing
----------------------------------------------------------------------------------------------------------------------------------
Overview
The D&H GOB (Glue on Board) Encapsulation Production Line offers fully customization solutions to meet diverse industrial needs, combining advanced encapsulation technology with modular design. Our production line prioritizes flexibility, enabling adjustment in size, mold configurations, software integration, and process parameters to align with specific client requirements.
Customizable Services
1. Production Line Dimensions
a. Scalable layouts to fit factory spaces ranging from compact workshops to large-scale facilities.
b. Adjustable conveyor widths (e.g., 500–2000 mm) and modular station placements for seamless integration with existing workflows.
2. Mold & Tooling Customization
b. Adjustable conveyor widths (e.g., 500–2000 mm) and modular station placements for seamless integration with existing workflows.
2. Mold & Tooling Customization
a. Material Compatibility: Molds compatible with nano-grade adhesives, UV-resistant resins, or specialty coatings for
b.anti-glare/anti-static finishes.
c. Precision Design: Custom cavity shapes and surface textures (matte/gloss) to optimize encapsulation uniformity.
3. Software & Automation
b.anti-glare/anti-static finishes.
c. Precision Design: Custom cavity shapes and surface textures (matte/gloss) to optimize encapsulation uniformity.
3. Software & Automation
a. Programmable Logic Control (PLC): Tailored dispensing algorithms for variable glue thickness and curing cycles.
b. AI-Driven Quality Monitoring: Real-time defect detection (<0.01% error rate) via adaptive AOI systems and predictive
maintenance alerts.
4. Process Parameters
b. AI-Driven Quality Monitoring: Real-time defect detection (<0.01% error rate) via adaptive AOI systems and predictive
maintenance alerts.
4. Process Parameters
a. Adjustable plunger pump pressure, flow rates, and nozzle configurations to accommodate low/high-viscosity adhesives.
b. Custom IP rating protocols and environmental stress-testing workflows.
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Applications
Ideal for bespoke projects requiring:
✔ High-mix, low-volume LED displays
✔ Specialized environments with strict durability standards.
b. Custom IP rating protocols and environmental stress-testing workflows.
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Applications
Ideal for bespoke projects requiring:
✔ High-mix, low-volume LED displays
✔ Specialized environments with strict durability standards.
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D&H LED Solution Modular GOB Bonding Equipment Energy Saving Design For LED / Electronics Industry
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