WDS750 Simulate Reflow Heating Mode BGA Reballing Machine with Preheating and Cooling

Brand Name:WDS
Certification:CE ISO
Model Number:WDS-750
Minimum Order Quantity:1 UNIT
Delivery Time:8-15 working days
Payment Terms:T/T, Western Union, MoneyGram
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Location: Shenzhen China
Address: No.6,Haosi Western Industry,Shangjing Town,Bao'an District,Shenzhen,China
Supplier`s last login times: within 8 hours
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Product Details

WDS-750 Optical Alignment BGA Rework Station High temperature control system


Features:

1.Touch screen interface,heating time,heating temp,temp rise speed,cooling time,alarm advance,vacuum time are set up inside the touch screen,easy to use;



2.Panasonic PLC, independent control temperature control module,shows 3 temp curves all the time,4 independent sensors,check the temp accurately for the chip points,ensure the weld yield;



3.3 independent heating zones,each heating zone can set up the heating temp,heating time,temp rise rate;Six period of heating temperature, simulate the reflow heating mode,set up as Preheating, keeping, heating, welding, welding, cooling;



4.Auto feed chip,auto pick up chip,auto blowing chip,can identify the central position automatically when optical alignment;



5.Multifunction mode choice, four modes as weld,remove,mount,manual,automatic and semi-auto function,meet the various needs of the users;



6.Uses the high precision K-type thermocouple closed-loop control which is imported from USA,with the unique heating method,ensure the weld temp precision control within ±1 ℃;



7.Uses imported optical alignment system,500 pixel HD camera,HDMMI HD signal output,15 inch HD LCD,high accurate micrometer X/Y/Z axis adjustment,ensure the location precision within 0.01-0.02mm;



8.The upper heating head and placement head are designed 2 in 1,different size of heating nozzles are provided,easy to remove and install,can be customized,meet the more requirement for users;



9.High automation and precision to avoid artificial error fully,can make the best repairing effect for the lead free technology,double-deck BGA,QFN,QFP,capacitance resistance and other components and parts;



10.Equipped the extra camera to obverse the solder ball melting,to ensure the temp curve and weld effect(this function is optional).



WDS-750 parameter:

Total power6800W
Upper heating power1200W
Bottom heating power1200W
Bottom IR heating power4200W(2400W is controlled)
Power supply(Single Phase) AC 220V±10 50Hz
Location wayOptical camera+ V-shape card slot + laser position for fast location
Temperature controlHigh precision K sensor closed loop control,independent temperature control with ±1 ℃ precision
Appliance selectionHigh sensitive touch screen + temperature control mode +Panasonic PLC +step driver
Max. PCB size550×480mm
Min. PCB size10×10mm
Sensor4units
Chip amplification multiple1-200X
PCB thickness0.5-8mm
Chip size0.2*0.4mm-9cm
Min. chip space0.15mm
Max. mount loading100G
Mount precision±0.01mm
Overall sizeL670×W770×H900mm
Optical cameraCan be removed front and back,left and right,prevent the dead angle
Machine weight90kg

China WDS750 Simulate Reflow Heating Mode BGA Reballing Machine with Preheating and Cooling supplier

WDS750 Simulate Reflow Heating Mode BGA Reballing Machine with Preheating and Cooling

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