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Entirety Design Multifunctional Independent T5 Full Automatic Screen Printer
Solder paste printing machines are mainly used to print solder
paste on the surface of circuit boards (PCBs). Apply solder paste
evenly onto the solder pads of the circuit board using tools such
as scrapers, providing precise and uniform solder paste
distribution for subsequent electronic component soldering. The
solder paste printing machine can accurately control the coating
position and thickness of solder paste through a high-precision
motion control system, ensuring the soldering quality between
electronic components and PCBs. Solder paste printing machines are
widely used in SMT surface mount production lines in the electronic
manufacturing industry.
Features:
Overall diagram:
1 Rack module
2 Lifting module
3 Platform alignment module
4 Image capture module
5 Stencil frame positioning module
6 Squeegee module
7 Display module
8 Cleaning module
9 Conveyor module
10 Air and power input
11 Housing module
Product Parameters:
Basic Parameters | Screen Frame Size | 650(X)×420(Y)—850(X)×850(Y) (mm) |
Thickness:20-40mm | ||
Min PCB(mm) | 50(X)×50(Y) (mm) | |
Max PCB(mm) | 510(X)×510(Y) (mm) | |
Thickness | 0.2mm~6mm(Use jig when pcb less than 0.4mm) | |
Curve | <1%(Diagonal measurement) | |
PCB Backside Part Height | 20mm | |
Conveyor Height | 900±40mm | |
Support | Magnetic support, Magnetic piece, Vacuum chamber(Option) | |
Clamp | Side clamp(Standard),please read the to option table | |
Edge Distance | PCB process edge≥2.5mm | |
Conveyor Speed | 0~1500mm/sec, increment 1mm | |
Conveyor Belt | U type sync belt | |
Stopper method | Air Cylinder | |
Stopper position | Set the PCB stopper position according to the size of board | |
Flow direction | L-R,R-L,L-L,R-R depends on customer | |
Print System | Print Speed | 5-200mm/sec adjustable |
Print Head | Step motor drive scraper lifting | |
Scraper | Steel scraper,rubber scraper(option) | |
Scraper Angle | 60° | |
Scraper Pressure | 0~20kg | |
Vision System | Substrate Separation | Three-section Substrate Separation speed:0.1-20mm/s distance:0-20mm |
Alignment Position method | Mark automatic alignment | |
Camera | Germany BASLER,1/3” CCD,640*480pixel, | |
Acquire image method | Up/under double photo | |
Camera Light | Coaxial light, Ring light four kinds light can adjustable | |
View Range | 9mm*7mm | |
Mark dimensions | Diameter or Side length 1mm~2mm,allowable offset 10% | |
Mark Shape | Cir, Rec, or rhombus etc | |
Mark Position | PCB dedicated mark or PCB pad | |
2D detection | Standard | |
Accuracy | Table Adjustment Range | X=±3mm,Y=±7mm, θ=±1.5° |
Positional Accuracy | ±0.01mm | |
Printing Accuracy | ±0.025mm | |
Time | Cycle Time | <10s (ex print, cleaning time) |
Convert line Time | <5min | |
Programming Time | <10min | |
Control System | Computer Configuration | Industrial PC,Windows official system |
System Language | Chinese,English | |
Pre and next machine Connection | SMEMA | |
User authorization | User PW and Senior PW set | |
Cleaning System | Cleaning System | Dry and Wet(standard),vacuum model(option) |
Liquid Level Detection | Liquid level auto alarm detection | |
Power Parameters | Main Power Supply | AC 220V±10% 50/60HZ Single phase |
Total Power | Approx.3kw | |
Main Air Supply | 4.5~6kgf/cm2 | |
Machine Weight | Approx.950Kg | |
Machine Dimension | 1530(L)x1680(W)x1540(H)mm | |
Option | Pneumatic Top Clamp | For PCB(thickness≤1mm) |
Top clamp + side clamp | For PCB(thickness≤1mm) | |
Vacuum Adsorption and unloading | For PCB(thickness≤1mm) and FPC | |
Auto tin added | / | |
Auto Loading and Unloading | / | |
Flexible and Universal Support | For the double-sided PCB (PCB backside parts Height ≤ 9mm) | |
Automatic Positioning of screen frame | Automatic Positioning of screen frame | |
PCB Thickness Auto Adjustment Function | Standard | |
Squeegee Pressure Feedback Function | / | |
Air conditioner | Customer can buy by themselves | |
The rest of Solder Paste on the stencil | / | |
SPI close loop | SPI close loop | |
UPS power off protection | UPS 15min power off protection | |
Industry 4.0 | Bar code trace function, production analysis etc |
Notices:
1.Gas source requirements: 4.5-6kgf/cm²; Inlet pipe Ø≥8mm.
2.Power requirements: single-phase AC 220V±10% 50/60HZ, power cord
with 4-6mm², equipped with a 16A well grounded socket.
3.Ground pressure requirement: 1000kg/m².
4.During the installation period, arrange 2-3 people to learn and
conduct training assessments.