Semiconductor Reflow Soldering Machine 70KW PCB Soldering Oven

Brand Name:Suneast
Certification:CE、ISO
Model Number:SEMI-08N|SEMI-10N|SEMI-13N
Minimum Order Quantity:≥1 pc
Delivery Time:25~50 days
Payment Terms:T/T
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Verified Supplier
Location: Shenzhen Guangdong China
Address: Suneast Ind.Park, No.13, Yongping 2nd Rd., Fuyong Street, Bao'an District, Shenzhen city,Guangdong Prov., China
Supplier`s last login times: within 27 hours
Product Details Company Profile
Product Details

SEMI Series Modular Design Semiconductor Reflow Soldering Oven Hot Air System


Application:

  • The solder paste which is printed on the convex metal surface will be refluxed into a ball to complete the combination welding of the tin ball and the substrate
  • After the chip is placed to the PCB, the chip and the circuit board are connected together to realize the chip packaging and integrated circuit manufacturing

Core Technology:

01 Hot air system with patent, efficient heat compensation ability, accurate temperature control accuracy

02 With nitrogen protection in the whole process, independent nitrogen control in each temperature zone, to prevent components oxidation during the welding process

03 Low oxygen content control in the furnace which will be within 50-200PPM during the whole process, to ensure good welding quality

04 Modular design, efficient cooling system, cooling slope can reach 0.5-6℃/S, to meet the requirements of each process cooling slope

05 Fine mesh belt for smooth conveying, also for tiny components transmission, prevent falling, to ensure stable product quality

06 Efficient and clean treatment, to meet the requirements of dust-free workshop for semiconductor


Product Features:

CONVEYOR SYSTEM

Special fine mesh belt transmission for semiconductor, for tiny components, to prevent falling and jamming

HOT AIR SYSTEM MULTI-FREQUENCY CONTROL

Multi-frequency converter control, more precise temperature control, the air flow range can be controlled from low to high, to ensure that the control system is stable and reliable

ROSIN RECOVERY SYSTEM

There’re independent rosin recovery devices at the inlet and outlet sides, and also for the preheating area, multistage filtration

FULL NITROGEN PROTECTION SYSTEM,

LOW OXYGEN CONTENT

The nitrogen is charging in the whole process and controlled Independently in each process section; ultra-low oxygen concentration environment, and the oxygen content in the furnace can be within 50PPM to ensure excellent welding quality

LOW NITROGEN CONSUMPTION

Brand new furnace structure design, multi-layer heat insulation, closed-loop control of recovery system, effectively save the amount of nitrogen and save the use cost

EFFICIENT HOT AIR CIRCULATION HEATING SYSTEM

Multi-layer heat insulation design, high stability of thermal

efficiency, low energy consumption, reduce production costs

COOLING SYSTEM

Cooling zone with high power cold water system to ensure optimal cooling slope

CONTROL SYSTEM

Super temperature control ability, to meet the packaging heating process profile of semiconductor

HIGH CLEANLINESS

Special clean room for R&D, thousand level of cleanliness, to meet the requirements of high cleanliness environment of semiconductor equipment

CONVEYOR SYSTEM

The software supports SECS/GEM semiconductor communication protocol, connects the intelligent factory information and control system, which can effectively realizes the functions of connection management, data collection, alarm, control status, equipment terminal service and message log, etc


Product Parameters:

Model NoSEMI-08NSEMI-10NSEMI-13N
Heating system
Heating zone structure

8 heating zones,

16 heating modules

10 heating zones,

20 heating modules

13 heating zones,

26 heating modules

Heating zone length2950mm3670mm4750mm
Heating up time20min25min25min
Outlet Exhaust Diameter,valume2-Ø145,Exhaust demand 10m³/min x2
Cooling system
Cooling typeThree cooling zones:forced water cooling
Cooling zone length1250mm
Chiller powerExternal Water chiller (Optional: connected to customer workshop cooling water)
Conveyor system
Conveyor TypeFine mesh mesh belt (Optional: B-shaped mesh belt, force bone mesh belt)
Conveyor DirectionL→R,R→L
Conveyor Height900±20mm
Mesh belt width24" (Other width sizes can be customized.)
Component Height20mm
Conveyor Speed300mm-2000mm/min
Control system
PowerAC3Ø 5W 380V 50/60HZ
Total Power70KW89KW118KW
Startup Power35KW38KW42KW
Normal consumption10KW12KW14KW
Temp Control RangeRoom temperature to 320℃
Control typePC+PLC Control system
Temp Control accuracy±1℃
PCB Temp Deviation±1.5℃
Data StorageProcess Data and status stotage
Power Outage ProtectionEquipped with UPS
Operation InterfaceWindows Chinese simplified, English online free switching
N2 areaFull nitrogen filling
Secs/Gemcommunication protocolStandard
MES communication protocolStandard
ComputerCommercial computer
Machine Parameter
Dimension(LxWxH)5680x1710x1650mm6400*1710*1650mm7500*1710*1650mm
Weight2400-2600kg3200-3400kg3600-3800kg
Flux recovery systemStandard
ColorBright wrinkled white

Notices:

1.Power requirements:

①Three phase five wire: voltage 380V, frequency 50/60HZ;

②Wire diameter above 25mm², leakage protection switch 160A, leakage protection switch leakage capacity 150-200mA.

2.The ground is required to withstand a pressure of 1000kg/m²

3.External ventilation requirements: air duct Ø145mm, ventilation volume 15-20M³/min.

China Semiconductor Reflow Soldering Machine 70KW PCB Soldering Oven supplier

Semiconductor Reflow Soldering Machine 70KW PCB Soldering Oven

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