Product Details
eMMC5.1 Memory Storage Chips IC Integrated Circuits Electronic
Components
The embedded MultiMedia Card(eMMC) is the flash memory standard set
by the MMC Association for mobile phones and tablets. It is an embedded multimedia memory card packaged into a BGA chip. eMMC is made using parallel transmission technology.
Line-up boasts 8GB to 256GB capacity
The Gemini series eMMC5.1 is based on high-performance controller
LDPC technology , Samsung and KIOXIA BiCS5 3DTLC/YMTC QLC NAND
Flash for multi-layer stacking, complying with the HS400 standard.
It meets customers' demanding requirements for large capacity, high
performance, low power consumption, compatibility, and stability of
eMMC in complex and diverse applications.
Definitive performance for mobile storage
With superior power efficiency and noticeably fast speed, PG’s eMMC
is the definitive choice for flash storage to develop slim mobile
design.
Tremendous Design Flexibility
We expect this memory to be popular among smartphone and tablet
manufacturers for years to come, sharing the spotlight with
ultra-fast, new-age Universal Flash Storage, for a number of
applications.
As PG Electronics’ memory and other semiconductor components
continue to improve at breakneck speed, consumers will benefit
immensely from the resulting flexibility in design, control, access
and storage that will be found in next generation mobile devices.
It’s rather amazing that the primary memory solution for almost
every mobile application over the past decade is something that
very few people beyond design engineers have ever heard about. Referred to as eMMC or embedded multimedia card memory, this
low-cost, high performance workhorse of mobile efficiency is one of
the largest selling memories in the world and has been for some
time. It’s designed for a wide range of applications in consumer
electronics such as mobile phones, and handheld computers, as well
as navigational systems, portable gaming and even industrial uses.
CA EMMC5.1 Specification
Model | G2564GTLCA | G25128TLCA | G25256TLCA | G25512TLCA |
NAND Flash | 3DTLC NAND | 3DTLC NAND | 3DTLC NAND | 3DTLC NAND |
Capacity | 64GB | 128GB | 256GB | 512GB |
CE | 1 | 2 | 4 | 4 |
Read Speed | up to 330MB/s | up to 330MB/s | up to 330MB/s | up to 330MB/s |
Write Speed | up to 240MB/s | up to 240MB/s | up to 240MB/s | up to 240MB/s |
Operating Temperature | -25℃~85℃ | -25℃~85℃ | -25℃~85℃ | -25℃~85℃ |
EP | ≥3000 | ≥3000 | ≥3000 | ≥3000 |
Packaging Specification | BGA 153 | BGA 153 | BGA 153 | BGA 153 |
Size | 11.5mmx13mmx1.0mm | 11.5mmx13mmx1.0mm | 11.5mmx13mmx1.2mm | 11.5mmx13mmx1.2mm |
WHY CHOOSE US?
1.Strong research and development strength
2. Our factory has advanced packaging and testing technology
3. Complete storage product production line
4. Operating our own brand PG focuses on the storage semiconductor
field
5. Possess multiple copyright patents
6. High cost-effectiveness, and competitiveness
7.Focus on IC field for more than serval years
Company Profile
Founded in 2019, China Chips Star Semiconductor Co., Ltd. is
headquartered in Shenzhen and has branches in Hong Kong, Nanjing,
and Singapore. It is a National High-Tech Enterprise and a
Specialized and Sophisticated Small and Medium-sized Enterprise,
focusing on the research and development, production, and sales of
storage chips, committed to providing cutting-edge storage
solutions for global customers.
We has over 100 employees, with professional and technical
personnel accounting for up to 70%. This high-quality team is the
driving force behind our continuous innovation. We are equipped
with a modern research and development testing center of 3000
square meters, which contains cutting-edge equipment and provides a
solid guarantee for the exploration and breakthrough of storage
technology. In terms of quality management, we strictly follow
international standards and have successfully passed the dual
certification of ISO9001 and IATF16949. This not only demonstrates
our strict requirements for product quality, but also proves our
service capabilities in high standard fields such as automotive
electronics. We are one of the three semiconductor enterprises in
Shenzhen that obtained certification from the Ministry of Industry
and Information Technology in 2023. It is also the only domestic
enterprise in China to receive strategic investment from one of the
world's four largest wafer manufacturers (KIOXIA Singapore
Subsidiary).
With strong technical strength and strict quality control system,
We has achieved rapid development. We have high-quality wafer
resources in the KIOXIA (Toshiba) series and maintain close
strategic partnerships with industry-leading main control chip
suppliers such as SMI, INNOGRIT, and StorArt, ensuring the
excellent performance and market competitiveness of our products.
With modern production and testing equipment, it achieves a daily
production capacity of over 100K, which is sufficient to meet the
growing market demand. At present, our product line covers eMMC, TF
cards, industrial grade SSD, as well as industrial and enterprise
grade BGA, which are widely used in multiple fields such as
consumer electronics, industrial control, automotive electronics,
and enterprise storage. In the future, we will continue to adhere
to the development concept of innovation driven, deeply cultivate
the field of storage chips, and strive to become a leading global
provider of storage solutions, contributing more to the prosperity
of the digital world.