Precision Engineered 15μm Pd Cu Bonding Wire Ultra Fine Pitch Compatibility for Sustainable Semiconductor Production
Brand Name:WINNER
Certification:ISO9001
Model Number:PW-24
Minimum Order Quantity:1pc
Delivery Time:5~8 working days.
Payment Terms:T/T, Western Union, L/C
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Shenzhen China
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B105, 90-5 Dayang Road, Rentian Community, Fuhai Street, Bao'an District, Shenzhen,P.R.China
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Precision Engineered 15μm Pd Cu Bonding Wire Ultra Fine Pitch Compatibility for Sustainable Semiconductor Production
The Precision-Engineered 15μm Pd-Cu Bonding Wire sets a new
benchmark in sustainable semiconductor manufacturing. Featuring
ultra-fine pitch compatibility (≤35μm), this wire enables flawless
interconnects in advanced IC packaging, MEMS devices, and
miniaturized IoT sensors, while reducing short-circuit risks by
90%. Its palladium-copper alloy core delivers 98% IACS conductivity
and 50% higher corrosion resistance than standard copper wires,
ensuring longevity in harsh environments like automotive and
industrial chips.
Certified RoHS/REACH compliant, this lead-free solution supports green electronics production with 40% lower carbon footprint compared to gold bonding alternatives. The nano-smooth surface finish minimizes ionic contamination, critical for aerospace-grade semiconductor reliability under extreme thermal cycling (-55°C to +200°C).
Optimized for high-speed wire bonding machines, it achieves 25% faster production cycles without compromising bond strength. Trusted by global Tier-1 OEMs, this wire combines eco-conscious engineering with cutting-edge performance, driving the transition to energy-efficient chip fabrication.
Material and Composition of the Bonding Wire
Our gold - plated/palladium bonding wire is made from 4N high - purity copper. The high purity ensures reliability and good electrical conductivity. We also added a proportion of trace elements in a controlled way. These elements, selected through research, enhance the wire's performance.
Our gold - plated/palladium bonding wire is made from 4N high - purity copper. The high purity ensures reliability and good electrical conductivity. We also added a proportion of trace elements in a controlled way. These elements, selected through research, enhance the wire's performance.
Unique Characteristics
the welding wire is corrosion - resistant. Corrosion can cause serious damage to the wire and lead to failure of the entire packaging system. Our special bonding wire is formulated to resist corrosion from various chemical substances that it may come into contact with during its use, whether it's in the manufacturing environment or during the normal operation of the IC.
Application in IC Packaging
This special gold/palladium bonding wire is for IC packaging. Its properties make it ideal for connecting IC components, providing stable electrical connections, withstanding mechanical stress, and resisting oxidation, arcs, and corrosion for optimal and stable IC performance, meeting modern electronics manufacturing requirements.
Pd Coated Copper Wire | ||||
Type | Ø Diameter ±1% μm | Breaking Load BL(gf) | Elongation EL(%) | Length Meters |
PW-1 | 18(0.7mil) | >4 | 8-14 | 500/1000/2000 |
20(0.8mil) | >5 | 9-15 | 500/1000/2000 | |
23(0.9mil) | >7 | 10-17 | 500/1000/2000 | |
25(1.0mil) | >9 | 11-17 | 500/1000/2000 | |
30(1.2mil) | >14 | 14-22 | 500/1000/2000 | |
Note: The above Diameter parameters can be customized according to customer requirements.
Application:
Precision Engineered 15μm Pd Cu Bonding Wire Ultra Fine Pitch Compatibility for Sustainable Semiconductor Production
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