Ultra Thin High Conductivity 15 Micron Palladium Coated Copper Wire for Advanced Semiconductor Chip Packaging and Precision Electronics Applications
Brand Name:WINNER
Certification:ISO9001
Model Number:PW-23
Minimum Order Quantity:1pc
Delivery Time:5~8 working days.
Payment Terms:T/T, Western Union, L/C
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Shenzhen China
Address:
B105, 90-5 Dayang Road, Rentian Community, Fuhai Street, Bao'an District, Shenzhen,P.R.China
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Ultra Thin High Conductivity 15 Micron Palladium Coated Copper Wire for Advanced Semiconductor Chip Packaging and Precision Electronics Applications
The Ultra-Thin High-Conductivity 15-Micron Palladium Coated Copper
Wire revolutionizes advanced semiconductor and electronics
manufacturing. Engineered with a precision 15μm diameter (1/5th of
human hair), this wire delivers gold-level conductivity while
offering 30% higher wear resistance than traditional gold wires,
ensuring stable signal transmission in high-frequency chip
packaging. Its palladium alloy coating enhances oxidation
resistance, critical for 5G, AIoT, and aerospace-grade microchips
exposed to extreme environments.
Ideal for fine-pitch bonding in CPU/GPU packaging, MEMS sensors, and medical device modules, it supports ≤40μm pad spacing with zero short-circuit risks. Compliant with ISO 14644-1 Class 5 cleanroom standards, it minimizes ion contamination for automotive-grade semiconductor reliability.
Ideal for fine-pitch bonding in CPU/GPU packaging, MEMS sensors, and medical device modules, it supports ≤40μm pad spacing with zero short-circuit risks. Compliant with ISO 14644-1 Class 5 cleanroom standards, it minimizes ion contamination for automotive-grade semiconductor reliability.
As a cost-efficient gold alternative, it reduces material costs by 60% without compromising performance. Trusted by global top-tier fabs, this wire combines cutting-edge nano-coating technology with industrial durability, empowering next-gen electronics miniaturization and sustainable production.
- Gold-plated/palladium bonding wire made of 4N high-purity copper material with a certain proportion of trace elements added;
- In addition to the characteristics of conventional copper wire, it also has high strength,low curvature, high toughness, and anti-oxidation Chemical characteristics, the arc isimpact-resistant and the welding wire is corrosion-resistant;
- Surface gold/palladium special bonding wire developed for IC packaging;
Pd Coated Copper Wire | ||||
Type | Ø Diameter ±1% μm | Breaking Load BL(gf) | Elongation EL(%) | Length Meters |
PW-1 | 18(0.7mil) | >4 | 8-14 | 500/1000/2000 |
20(0.8mil) | >5 | 9-15 | 500/1000/2000 | |
23(0.9mil) | >7 | 10-17 | 500/1000/2000 | |
25(1.0mil) | >9 | 11-17 | 500/1000/2000 | |
30(1.2mil) | >14 | 14-22 | 500/1000/2000 | |
Note: The above Diameter parameters can be customized according to customer requirements.
Application:
Ultra Thin High Conductivity 15 Micron Palladium Coated Copper Wire for Advanced Semiconductor Chip Packaging and Precision Electronics Applications
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