Excellent Electrical Conductivity Ultra Fine Wire 0.01 Mm Cu Bonding Wire For Semiconductor Packaging
Brand Name:WINNER
Certification:ISO 9001, ISO 14001, RoHS
Model Number:WCBW-5
Minimum Order Quantity:1pc
Delivery Time:5~8 working days.
Payment Terms:T/T, Western Union, L/C
Contact Now
Add to Cart
Verified Supplier
Location:
Shenzhen China
Address:
B105, 90-5 Dayang Road, Rentian Community, Fuhai Street, Bao'an District, Shenzhen,P.R.China
Supplier`s last login times:
within 29 hours
Product Details
Company Profile
Product Details
Excellent Electrical Conductivity Ultra Fine wire 0.01 mm Cu Bonding Wire for Semiconductor Packaging
Engineered for high-performance semiconductor packaging, this ultra-fine 0.01mm copper bonding wire delivers excellent electrical conductivity (≤1.7 μΩ·cm) rivaling gold wires at a fraction of the cost. Utilizing a
proprietary anti-oxidation nano-coating, it overcomes traditional copper wire limitations, ensuring stable
performance in harsh environments (-55°C to 250°C) while preventing
corrosion and sulfidation common in humid conditions.
Ideal for high-density interconnects, its 0.01mm diameter enables precise bonding in advanced ICs,
MEMS, and power devices, reducing signal loss by 30% compared to
standard copper wires. With a tensile strength of ≥3,500 MPa and elongation rates optimized for thermosonic bonding, it minimizes wire sagging and breakage during high-speed
assembly, achieving consistent ball diameters (2.8–3.2φ) and loop
heights.
ROHS-compliant and halogen-free, this wire cuts packaging costs by 50% versus
gold wires while meeting stringent automotive (AEC-Q100) and 5G
module reliability standards. Adopted by leading OSATs, it’s the
sustainable choice for next-gen EVs, AI chips, and IoT devices
demanding cost-efficiency without compromising conductivity.
Winner can provide Copper bonding wire with different wire
diameters from 10um-40um according to customer requirements.
| Characteristics |
| * High conductivity * High tensile strength with high elongation * Good loop stability * Significantly reduced formation of intermetallic phases * Very good ball formation under protective gas |
Description of Copper Bonding Wire
The Copper bonding wire is material for semiconductor packaging which has excellent electrical conductivity, thermal conductivity, mechanical properties, and chemical stability. This product is used as an inner lead for packaging and is one of the essential materials in the manufacturing process of integrated circuits and semiconductor separators. The Copper bonding wire has the advantages of low price, good mechanical properties, and high electrical conductivity.
The Copper bonding wire is material for semiconductor packaging which has excellent electrical conductivity, thermal conductivity, mechanical properties, and chemical stability. This product is used as an inner lead for packaging and is one of the essential materials in the manufacturing process of integrated circuits and semiconductor separators. The Copper bonding wire has the advantages of low price, good mechanical properties, and high electrical conductivity.
Applications include:
* Computer : PC, Tablets, Servers & systems, Consumer
* Computer : PC, Tablets, Servers & systems, Consumer
* Electronics : Smartphones & phones, TVs, Imaging devices,
Wearable electronics
* Automotive : Body, Safety, Infotainment, Chassis, Powertrain, Security
* Communications : Wireless, Wired, Satellite, NFC
* Energy : Generation, Transmission & distribution, Storage
* Automotive : Body, Safety, Infotainment, Chassis, Powertrain, Security
* Communications : Wireless, Wired, Satellite, NFC
* Energy : Generation, Transmission & distribution, Storage
| Dia | EL(%) | BL(gf) | |||||||
| mil | um | 4N | 5N | 4N | 5N | ||||
| WCBW-1 | WCBW-2 | WCBW-3 | WCBW-4 | WCBW-5 | WCBW-6 | WCBW-7 | WCBW-8 | ||
| 0.6 | 15 | 3-15 | 3-15 | 3-16 | 3-17 | >3.0 | >3.0 | >3.0 | >3.0 |
| 0.7 | 18 | 3-17 | 3-17 | 3-18 | 4-19 | >3.0 | >3.0 | >3.5 | >4.0 |
| 0.8 | 20 | 4-18 | 4-18 | 4-19 | 5-20 | >4.0 | >4.5 | >5.0 | >5.0 |
| 0.9 | 23 | 6-20 | 6-20 | 6-21 | 6-22 | >5.0 | >6.0 | >6.0 | >6.5 |
| 1.0 | 25 | 8-22 | 8-23 | 8-24 | 8-24 | >6.0 | >7.0 | >7.0 | >8.0 |
| 1.2 | 30 | 9-23 | 9-24 | 9-25 | 9-26 | >8.0 | >8.5 | >8.0 | >10.0 |
| 1.3 | 33 | 9-24 | 10-25 | 10-26 | 10-27 | >10.0 | >11.0 | >10.0 | >12.0 |
| 1.5 | 38 | 10-25 | 10-26 | 10-27 | 11-28 | >12.0 | >12.0 | >12.0 | >14.0 |
| 1.7 | 43 | 10-26 | 11-28 | 10-30 | 11-30 | >15.0 | >16.0 | >15.0 | >18.0 |
| 2.0 | 50 | 12-28 | 12-30 | 12-32 | 12-34 | >20.0 | >20.0 | >20.0 | >20.0 |
The Advantages of Copper Bonding Wire Cost Savings
The relatively low cost of copper is one of the reasons for its
appeal as an alternative interconnect material. By replacing gold
wires with copper material, thus replacing the precious metal part,
significant cost savings are possible. In applications that require
increased wire diameters, the usage of copper bears a
disproportionately high impact on the saving effect. Superior
Performance of Copper Wires Copper exhibits significantly better
conductivity than gold or aluminum. Therefore better heat
dissipation and increased power ratings are attainable with thinner
wire diameters. Copper possesses higher mechanical properties
compared to gold. Therefore it displays excellent ball neck
strength and high loop stability during molding or encapsulation.
Excellent Electrical Conductivity Ultra Fine Wire 0.01 Mm Cu Bonding Wire For Semiconductor Packaging
Inquiry Cart
0