Extreme bond reliability 0.01mm Ultra Fine Gold Bonding Wire for various applications
Brand Name:WINNER
Certification:ISO 9001, ISO 14001, RoHS
Model Number:WGBW-1
Minimum Order Quantity:1pc
Delivery Time:5~8 working days.
Payment Terms:T/T, Western Union, L/C
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Location:
Shenzhen China
Address:
B105, 90-5 Dayang Road, Rentian Community, Fuhai Street, Bao'an District, Shenzhen,P.R.China
Supplier`s last login times:
within 29 hours
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Product Details
Extreme bond reliability Ultra Fine Gold Bonding Wire for for various applications
Winner offers a wide selection of ball, wedge and stud bonding
wires in a varied portfolio of 4N 99.99 / 3N 99.9 / 2N 99.0.
* Raw materials of high purity (99,999 %)
* Stable mechancial qualities
* Wire surface of high quality
* Made according to customer specifications
* With a diameter down to a size of 0.6 mils / 15 microns for very
fine applications.
* For ball or wedge bonding or stud bumping
The gold bonding wire is a kind of material for semiconductor
packaging which has excellent electrical conductivity, thermal
conductivity, mechanical properties, and chemical stability. This
product is used as an inner lead for packaging and is one of the
essential materials in the manufacturing process of integrated
circuits and semiconductor separators. Winner can provide Au
bonding wire with different wire diameters from 13um-50um according
to customer requirements.
Our comprehensive in-house capabilities, which encompass casting, drawing, annealing, and A2LA-accredited analytical methods, guarantee the delivery of homogeneous, high-purity wire. This wire not only features ultra-clean surfaces but also a smooth finish, making it ideal for various applications.
Physical Properties
Density: | 19.34 g/cm3 |
Melting Point: | 1063°C |
Electrical Resistivity: (@20°C) | 2.3 μΩ-cm |
Electrical Conductivity: (@20°C) | 75% (IACS) |
Thermal Conductivity: (@20°C) | 315 W/(m-K) |
Fusing Current (10 mm x 25 μm) | 0.52 A |
We take pride in offering a complete range of wire diameters,
thereby fulfilling the diverse needs for strength and elongation in
different wire applications. Moreover, we collaborate closely with
our customers to provide customized solutions. In these custom
solutions, technical parameters such as tensile strength and
elongation are meticulously tailored to meet their specific
requirements. This customer-centric approach enables us to not only
meet but exceed the expectations of our clients in the highly
competitive market of wire manufacturing and bonding applications.
Composition | Diameter | Tensile Strength (gms) | Elongation (%) | |
99.99% Au | 0.7 mil | 17.5 μm | 3 - 10 | 2 - 6 |
0.8 mil | 20 μm | 4 - 13 | 2 - 7 | |
0.9 mil | 22.5 μm | 5 - 16 | 2 - 8 | |
1.0 mil | 25 μm | 6 - 20 | 2 - 8 | |
1.3 mil | 32.5 μm | 10 - 45 | 2 - 10 | |
1.5 mil | 37.5 μm | 13 - 50 | 2 - 12 | |
1.7 mil | 42.5 μm | 15 - 60 | 2 - 12 | |
1.8 mil | 45 μm | 20 - 70 | 2 - 12 | |
2.0 mil | 50 μm | 25 - 85 | 2 - 15 | |
3.0 mil | 75 μm | 50 - 180 | 2 - 20 | |
Why Gold Bonding Wire?
Gold (Au) bonding wire is used in a wide range of applications
rangining from high pin-count, ultra-fine pitch microelectronic
devices to high-power discrete components. Au is the preferred
choice of bonding material when a) the contact material is not
compatible with Aluminum (Al) and/or Copper (Cu) b) the contact
area is limited c) the device will be subject to high temperature
or high humidity environments.
The Advantages of Gold Bonding Wire:
• Extreme bond reliability
• A wide processing window
• Low-impact ball and wedge bonding
• Superior looping performance
• High tensile test performance
• Excellent corrosion resistance
• Higher fusing current than standard Al bond wire.
Extreme bond reliability 0.01mm Ultra Fine Gold Bonding Wire for various applications
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