Product Details
Premium Ultra Fine Wire Gold Bonding Wire for Advanced Electronic
Bonding Applications
Winner stands out in the industry by specializing in the
manufacturing of gold balls and wedge bonding applications with an
astounding min purity of up to 99.99%.
Our comprehensive in-house capabilities, which encompass casting,
drawing, annealing, and A2LA-accredited analytical methods,
guarantee the delivery of homogeneous, high-purity wire. This wire
not only features ultra-clean surfaces but also a smooth finish,
making it ideal for various applications.
Density: | 19.34 g/cm3 |
Melting Point: | 1063°C |
Electrical Resistivity: (@20°C) | 2.3 μΩ-cm |
Electrical Conductivity: (@20°C) | 75% (IACS) |
Thermal Conductivity: (@20°C) | 315 W/(m-K) |
Fusing Current (10 mm x 25 μm) | 0.52 A |
We take pride in offering a complete range of wire diameters,
thereby fulfilling the diverse needs for strength and elongation in
different wire applications. Moreover, we collaborate closely with
our customers to provide customized solutions. In these custom
solutions, technical parameters such as tensile strength and
elongation are meticulously tailored to meet their specific
requirements. This customer-centric approach enables us to not only
meet but exceed the expectations of our clients in the highly
competitive market of wire manufacturing and bonding applications.
Composition | Diameter | Tensile Strength (gms) | Elongation (%) |
99.99% Au | 0.7 mil | 17.5 μm | 3 - 10 | 2 - 6 |
0.8 mil | 20 μm | 4 - 13 | 2 - 7 |
0.9 mil | 22.5 μm | 5 - 16 | 2 - 8 |
1.0 mil | 25 μm | 6 - 20 | 2 - 8 |
1.3 mil | 32.5 μm | 10 - 45 | 2 - 10 |
1.5 mil | 37.5 μm | 13 - 50 | 2 - 12 |
1.7 mil | 42.5 μm | 15 - 60 | 2 - 12 |
1.8 mil | 45 μm | 20 - 70 | 2 - 12 |
2.0 mil | 50 μm | 25 - 85 | 2 - 15 |
3.0 mil | 75 μm | 50 - 180 | 2 - 20 |
Why Gold Bonding Wire?
Gold (Au) bonding wire is used in a wide range of applications
rangining from high pin-count, ultra-fine pitch microelectronic
devices to high-power discrete components. Au is the preferred
choice of bonding material when a) the contact material is not
compatible with Aluminum (Al) and/or Copper (Cu) b) the contact
area is limited c) the device will be subject to high temperature
or high humidity environments.
The Advantages of Gold Bonding Wire:
• Extreme bond reliability
• A wide processing window
• Low-impact ball and wedge bonding
• Superior looping performance
• High tensile test performance
• Excellent corrosion resistance
• Higher fusing current than standard Al bond wire.
1.What kind of Enameled copper wire do Winner produce?
We focus on research and development of selfbonding magnet round
copper wire, fine polyurethane magnet wire, selfbonding litz copper
wire and selfbonding silk covered wire.
2.What's diameters available of the Enamelled copper wire ?
We specialize in fine and ultra fine enamelled copper
wire,diameters available of our products is Φ0.018-0.50mm.
3.What's selfbonding enameled copper wire?
Selfbonding enamelled copper wire is a special type of enamelled
wire with an additional adhesive enamel overcoat such as
thermoplastic resin.This adhesive has a bonding feature, which is
activated
by heat or solvents.
Once activated the adhesive bonds turn to turn windings into a
compact self supporting coil.
The use of selfbonding wire may offer cost and manufacturing
advantages in some winding applications
as bobbins, tape, varnishing, or impregnation may be eliminated.
4. Is possible to get any sample of selfbonding enamelled copper
wire that you have in production?
Of course you can!
Company Profile
Since its foundation in 2009 in Sichuan Suining, Sichuan WINNER Special Electronic Materials Co., Ltd. has built a diversified
range of business including research and development, production,
and sales of semiconductor packaging materials.
As we focused on A Ultra-fine Coated Metal Wire, WINNER is becoming a glabal leader in this industry. Currently, it has a
plant construction area of 15,000 square meters, including a clean
room area of 11,000 square meters, with a cleanliness level of less
than 10,000 grades, and the winding clean bench reaches 1,000
grades.
WINNER has gathered top technical and management experts in the industry
and has successfully developed high-purity aluminum wires,
high-purity copper wires, gold-palladium-copper wires, pure gold
wires, silver alloy wires, etc., suitable for discrete
semiconductor devices and IC packaging;
WINNER passed the national high-tech enterprise certification in 2015,
and currently has more than 40 research and development.
Over the course of many years, all group companies within China
work together with unified cooperation between manufacturing,
sales, and technological aspects to offer products and services.
Additionally, to make further progress in globalization, the five
core companies that make up Sichuan Winner are as follows.
- Sichuan WINNER Special Electronic Materials Co., Ltd. (Head office)
- Winner (Shanghai) Semiconductor Materials Co., Ltd.
- Winner (Suzhou) Branch
- Shenzhen Youfu Technology Co., Ltd.(Overseas Development
Department)

