Multilayer HDI PCB Manufacturer Rigid Printed Circuit Board For Portable Game Console
Brand Name:TECircuit
Certification:UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949, ROHS,REACH.
Model Number:TEC0230
Minimum Order Quantity:1pcs
Delivery Time:5-15 wotk days
Payment Terms:L/C, D/A, D/P, T/T, Western Union, MoneyGram
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Verified Supplier
Location:
Shenzhen China
Address:
Room404,Building A2,Shunjing Pioneer Park,NO3 Longteng 3rd road, jixiang community,longcheng street,longgang district,ShenZhen, China
Supplier`s last login times:
within 2 hours
Product Details
Company Profile
Product Details
Product Images
About TECircuit
Found: TECircuit has been operating since 2004.
Location: An electronics manufacturing service(EMS) provider located in
Shenzhen China.
Item: Customizable EMS PCB, offers a full range of one-stop shop services.
Service: Printed Circuit Board (PCB)and Printed Circuit Board Assembly(PCBA), Flexible Printed Circuit Board(FPC), Components Sourcing, Box-Building, Testing.
Quality Assurance: UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949 andcomplied with ROHS and REACH.
Factory Pictures:
Company's own plant : 50,000 sqm; Employees : 930+; Monthly
production capacity : 100,000 m2
Product Applications
Handheld Gaming Devices:
- Integrated into devices like Nintendo Switch, PlayStation Vita, and other portable gaming consoles, providing a powerful gaming experience.
Mobile Gaming:
- Found in smartphones and tablets that support gaming applications, facilitating high-quality gaming on mobile platforms.
Retro Gaming Consoles:
- Used in portable retro gaming systems that emulate classic games, appealing to nostalgic gamers.
Virtual Reality (VR) Headsets:
- Employed in VR devices that require integrated processing power for immersive gaming experiences.
Educational Gaming Devices:
- Integrated into portable consoles designed for educational purposes, combining learning and gaming.
Fitness Gaming:
- Used in portable devices that gamify exercise routines, encouraging physical activity through interactive gaming.
Development Kits:
- Found in DIY and development kits for hobbyists and developers to create and test portable gaming applications.
Augmented Reality (AR) Devices:
- Utilized in AR gaming systems that require real-time processing and interaction with the environment.
Cloud Gaming Devices:
- Integrated into consoles designed for cloud gaming, enabling users to stream games over the internet.
Community and Competitive Gaming:
- Used in devices tailored for tournaments and competitive gaming, providing features that enhance multiplayer experiences.
Product Features
High-Density Interconnect (HDI) Design:
- Utilizes HDI technology for a compact layout, enabling intricate circuitry in a smaller form factor, essential for portable devices.
Enhanced Signal Integrity:
- Designed for high-frequency signals, ensuring smooth graphics and audio performance during gaming.
Multi-Layer Capability:
- Supports multiple layers to accommodate various components such as processors, memory, and graphics chips, enhancing overall functionality.
Low Power Consumption:
- Optimized for energy efficiency, extending battery life for longer gaming sessions without frequent recharging.
Integrated Components:
- Houses a variety of components including CPUs, GPUs, audio processors, and wireless communication modules, facilitating a comprehensive gaming experience.
Thermal Management:
- Features layouts that promote effective heat dissipation, crucial for maintaining performance during intense gaming sessions.
Robust Connectivity:
- Supports multiple communication protocols (e.g., Wi-Fi, Bluetooth) for online gaming, multiplayer connectivity, and updates.
Compact and Lightweight:
- Small and lightweight design makes it easy to carry, enhancing portability for gaming on the go.
Durability:
- Built with materials that withstand physical wear and tear, ensuring longevity in various environments.
Customizable Layout:
- Flexible design allows for optimization based on specific gaming requirements or user preferences.
FAQ
Question 1: What is needed for a quotation?
Answer:
PCB: QTY, Gerber file, and Technical Requirements( material/surface
finish treatment/copper thickness/board thickness,...)
PCBA: PCB information, BOM,(Testing documents...)
Q2: What file formats do you accept for production?
Answer:
PCB Gerber file
BOM list for PCB
Test method for PCBA
Q3: Are my files safe?
Answer:
Your files are held completely safe and secure. We protect the IP
for our customers in the whole process. All documents from
customers are never shared with any 3rd parties.
Q4: What is the shipment method?
Answer:
We can offer FedEx /DHL / TNT / UPS for shipment. Also, customer
provided shipment method is acceptable.
Q5: What is the payment method?
Answer:
Telegraphic Transfer in advance (Advance TT, T/T), PayPal is
acceptable.
Product Description
| Specification: | |||||
| PCB layers: | 1-42layers | ||||
| PCB materials: | CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free | ||||
| PCB max. board size: | 620mm*1100mm | ||||
| PCB certificate: | RoHS Directive-Compliant | ||||
| PCB Thickness: | 1.6 ±0.1mm | ||||
| Out Layer Copper Thickness: | 0.5-5oz | ||||
| Inner Layer Copper Thickness: | 0.5-4oz | ||||
| PCB max. board thickness: | 6.0mm | ||||
| Minimum Hole Size: | 0.20mm | ||||
| Minimum Line Width/Space: | 3/3mil | ||||
| Min. S/M Pitch: | 0.1mm(4mil) | ||||
| Plate Thickness and Aperture Ratio : | 30:1 | ||||
| Minimum Hole Copper: | 20µm | ||||
| Hole Dia. Tolerance(PTH): | ±0.075mm(3mil) | ||||
| Hole dia. Tolerance(NPTH): | ±0.05mm (2mil) | ||||
| Hole Position Deviation: | ±0.05mm (2mil) | ||||
| Outline Tolerance: | ±0.05mm (2mil) | ||||
| PCB solder mask: | Black, white, yellow | ||||
| PCB surface finished: | HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver | ||||
| Legend: | White | ||||
| E-test: | 100% AOI, X-ray, Flying probe test. | ||||
| Outline: | Rout and Score/V-cut | ||||
| Inspection Standard: | IPC-A-610CCLASSII | ||||
| Certificates: | UL (E503048),ISO9001/ISO14001/IATF16949 | ||||
| Outgoing Reports: | Final Inspection, E-test, Solderability Test, Micro Section and More | ||||
Multilayer HDI PCB Manufacturer Rigid Printed Circuit Board For Portable Game Console
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