TIF100-20-10S 2.0W Thermal Conductivity Silicon Pad Silicon Insulation Pads Cooling Gap Filler Silicone Pads For GPU CPU

Brand Name:Ziitek
Certification:RoHS
Model Number:TIF100-20-10S
Minimum Order Quantity:1000pcs
Delivery Time:3-5 work days
Payment Terms:T/T
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Address: Plot CN4, Ming Lang Industrial Cluster, Vu Thu district, Thai Binh Province, Vietnam
Supplier`s last login times: within 1 hours
Product Details Company Profile
Product Details

2.0W Thermal Conductivity Silicon Pad Silicon Insulation Pads Cooling Gap Filler Silicone Pads For GPU CPU


Product descriptions


TlF®100-20-10S use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.


Features


> Good thermal conductive 2.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> RoHS compliant
> UL recognized
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses


Application


> Mainboard/mother board
> Notebook
> Power supply
> CPU
> Micro heat pipe thermal solutions
> Telecommunication hardware
> Routers
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units

> Memory Modules
> Mass storage devices


Typical Properties of TIF®100-20-10S Series
PropertyValueTest method
ColorGray*****
Construction &CompostionCeramic filled silicone elastomer*****
Specific Gravity2.65g/ccASTM D297
Thickness range0.020"(0.50mm)~0.200"(5.0mm)ASTM D374
Hardness45±5 Shore 00ASTM 2240
Continuos Use Temp-45 to 200℃*****
Dielectric Breakdown Voltage>5500 VACASTM D149
Dielectric Constant4.7 MHzASTM D150
Volume Resistivity1.0X10¹² Ohm-meterASTM D257
Flame rating94 V0UL E331100
Thermal conductivity2.0W/m-KASTM D5470

Standard Thicknesses

0.020-inch to 0.200-inch (0.5mm to 5.0mm)


Product Sizes:

8" x 16"(203mm x406mm)

Individual die cut shapes and custom thickness can be supplied.

Please contact us for confirming

Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Company Profile


Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.


Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL


Ziitek Culture


Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

China TIF100-20-10S 2.0W Thermal Conductivity Silicon Pad Silicon Insulation Pads Cooling Gap Filler Silicone Pads For GPU CPU supplier

TIF100-20-10S 2.0W Thermal Conductivity Silicon Pad Silicon Insulation Pads Cooling Gap Filler Silicone Pads For GPU CPU

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