TIS806K-13-08 Electrically Isolating Thermal Conductive Insulating Materials For Power Semiconductors
Brand Name:Ziitek
Certification:UL and RoHs
Model Number:TIS806K-13-08
Minimum Order Quantity:1000pcs
Delivery Time:3-5 work days
Payment Terms:T/T
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Plot CN4, Ming Lang Industrial Cluster, Vu Thu distric, Thai Binh Province, Vietnam
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Product Details
Company Profile
Product Details
TIS806K-13-08 Electrically Isolating Thermal Conductive Insulating Materials For Power Semiconductors
The TIS®806K-13-08 Series of products are highly efficient insulating products and they also have thermal conductivity. It achieves the effect of both insulation and heat conduction by adding insulating silicone base material to the heat-conducting material.
Features:
> High thermal conductive and High dielectric strength
> Low thermal resistance with high voltage isolation
> Resistant to tears and punctures
> Easy release construction
> Electrically isolating
> High durability
Applications:
> Car Battery & Power Supply
> Power semiconductors
> Audio and Video components
> Motor controllers
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Routers
> Medical Devices
> Auditioning electronic products
> unmanned aerial vehicle(UAV)
| Typical Properties of TIS®806K-13-08 Series | ||
| Property | Value | Test Method |
| Color | Beige | Visual |
| Construction &Compostion | Ceramic filled silicone elastomer /Polyimide Film | ****** |
| Thickness range | 0.006inch (0.152mm) | ASTM D374 |
| Tensile Strength(MPa) | 34 | ASTM D412 |
| Density | 2.4 g/cc | ASTM D297 |
| Continuos Use Temp | -60 to 180℃ | ****** |
| Breakdown Voltage(V/mm) | 6000 | ASTM D149 |
| Dielectric Constant @ 1MHz | 3.7 | ASTM D150 |
| Volume Resistivity | 1.0X1012 Ohm-meter | ASTM D257 |
| Fire rating | 94 V0 | UL(E331100) |
| Thermal conductivity | 1.3W/m-K | ASTM D5470 |
| Thermal impedance(℃-in²/W)@30psi | 0.46 | ASTM D5470 |
Standard Thicknesses
0.006inch (0.152mm)
Standard Sizes
12" x 160"(304mm x 48.76M)
The TlS series can be die-cut into different shapes and provided. lf you need different thicknesses, please contact our company.
Packaging Details & Lead time
The packaging of Thermal Insulation Materials
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company profile
With professional R&D capabilities and many year experiences in
thermal interface material industry, Ziitek company own many unique
formulations which are our core technologies and advantages. Our
goal is to provide quality & competitive products to our customers
worldwide aiming for long-term business cooperation.
Independent R&D team
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TIS806K-13-08 Electrically Isolating Thermal Conductive Insulating Materials For Power Semiconductors
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