TS-TIF100 10020-11 Conductivity Thermal Pads Thermal Conductive Insulator For Radiators Heat Dissipation Structure

Brand Name:Ziitek
Certification:UL and RoHs
Model Number:TS-TIF100 10020-11
Minimum Order Quantity:1000pcs
Delivery Time:3-5 work days
Payment Terms:T/T
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Address: Plot CN4, Ming Lang Industrial Cluster, Vu Thu district, Thai Binh Province, Vietnam
Supplier`s last login times: within 1 hours
Product Details Company Profile
Product Details

TS-TIF100 10020-11 Conductivity Thermal Pads Thermal Conductive Insulator For Radiators Heat Dissipation Structure


The TS-TIF®100 10020-11 Series thermally conductive interiace materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effectively enhances the efficiency and life-time of the heat-generating electronic components.

Features:
> Excellent themal conductivity: 10.0 W/mK

> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure application environments
> Available in different thickness options


Applications:
> Heat dissipation structure for radiators

> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles

> LED Tv and lamps

Typical Properties of TS-TIF®100 10020-11 Series
PropertyValueTest Method
ColorGrayVisual
Construction &CompostionCeramic filled silicone elastomer******
Thickness range0.012~0.118inch (0.300~3.000mm)ASTM D374
Hardness (Shore OO)20ASTM D2240
Density3.3g/ccASTM D297
Recommended Operating Temperature-40 to 200℃******
Breakdown Voltage(V/mm)≥5500ASTM D149
Dielectric Constant @ 1MHz6.5ASTM D150
Volume Resistivity≥1.0X10¹² Ohm-meterASTM D257
Fire rating94 V0equivalent UL
Thermal conductivity10.0W/m-KASTM D5470

Product Specifications
Standard Thickness:

0.012"(0.3 mm)~0.118" (3.0 mm) with increments of 0.01(0.25 mm).


Standard Size:

8"×16”(203 mm×406 mm).


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1(Non-adhesive treatment), DC1 (Single-sided hardening).

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
Notes:FG(Fiberglass)provides enhanced strength, suitable for materials with thicknesses of0.01to 0.02 inch (0.25 to 0.50 mm).
The TIF series is available in custom shapes and various forms. For other thicknesses or moreinformation, please contact us.

Packaging Details & Lead time


The packaging of Thermal Insulation Materials

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

Independent R&D team


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China TS-TIF100 10020-11 Conductivity Thermal Pads Thermal Conductive Insulator For Radiators Heat Dissipation Structure supplier

TS-TIF100 10020-11 Conductivity Thermal Pads Thermal Conductive Insulator For Radiators Heat Dissipation Structure

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