TIF035AB-05S High Thermal Conductive Paste Heat Transfer Gel Double-Component Thermal Conductive Gel
Brand Name:Ziitek
Certification:RoHS
Model Number:TIF035AB-05S
Minimum Order Quantity:1000 pcs
Delivery Time:3-5 work days
Payment Terms:T/T
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Plot CN4, Ming Lang Industrial Cluster, Vu Thu distric, Thai Binh Province, Vietnam
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Product Details
Company Profile
Product Details
TIFTM035AB-05S High Thermal Conductive Paste Heat Transfer Gel Double-Component Thermal Conductive Gel
TIFTM035AB-05S is a highly thermal conductive, liquid gap filling material. It is provide with two-component and different temperature curing system. The product was supplied as highly thermal conductive, soft and elastomer for coupling on electrical devices modul. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components. It is liquid approach offer variety of thickness, replacing individual die-cut and specific pad thickness. Different from grease, the cured product is dry and can be touch. It can intented for use in thermal applications.
Feature
< Good thermal conductive: 3.5WW/mK
< Two-part formulation for easy storage
< Exceilent low and high temperature mechanical and chemical
stability
< Ultra-conforming low-stress interface application
< Ambient or accelerated cure schedules
< Ambient or accelerated cure schedules
< Optimized shear thinning characteristics for ease of
dispensing
Applications
< Notebook
< Computer and peripherals
< Telecommunications
< Automotive electronics
< Thermally conductive vibrationd ampening
< Heat sink and any heatgenerating semicondutor
| Typical Properties of TIFTM035AB-05S Series | |||
| Typical Uncured Material | |||
| Property | Numerical | Test Method | |
| Color/Part A | White | Visual | |
| Color/Part B | Blue | Visual | |
| Viscosity as Mixed (cps) | 200K Pa.s | GB/T 10247 | |
| Density | 3.1g/cm3 | ASTM D792 | |
| Mix Ratio | 1:1 | ****** | |
| Shelf Life@25℃ | 6 months | ****** | |
| Cure Schedule | |||
| Pot Life @25℃ | 30min | Ziitek Test Method | |
| Cure @25℃ | 16-24hours | Ziitek Test Method | |
| Cure @100℃ | 30min | Ziitek Test Method | |
| Cure Properties | |||
| Color | Blue | Visual | |
| Hardness | 55 shore00 | ASTM D2240 | |
| Continuous Use Temp | -45~200℃ | ****** | |
| Voltage Strength | 200V/mil | ASTM D149 | |
| Dielectric Constant | 4.4MHz | ASTM D150 | |
| Volume Resistivity | ＞1012 Ohm-cm | ASTM D257 | |
| Flame Rating | 94V0 | E331100 | |
| Thermal Conductivity | 3.5W/Mk | ISO22007-2 | |
| ASTM D5470 | |||
Product packing details:
50cc/pc, 48pcs/box; 400cc/pc, 9pcs/box
We offer the custom packaged in Syringes for automated despensing
applications. Please contact us for confirming.
Company Profile
Vietnam Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.
FAQ
Q: Are you trading company or manufacturer ?
A: We are manufacturer in Vietnam.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
TIF035AB-05S High Thermal Conductive Paste Heat Transfer Gel Double-Component Thermal Conductive Gel
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