TIF030AB-05S Two Component Liquid Easily Thermal Gap Filling Material Silicone Thermal Gel For Power Semiconductor
Brand Name:Ziitek
Certification:RoHS
Model Number:TIF030AB-05S
Minimum Order Quantity:1000 pcs
Delivery Time:3-5 work days
Payment Terms:T/T
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Plot CN4, Ming Lang Industrial Cluster, Vu Thu distric, Thai Binh Province, Vietnam
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Product Details
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Product Details
TIF030AB-05S Two Component Liquid Easily Thermal Gap Filling Material Silicone Thermal Gel For Power Semiconductor
TIF030AB-05S is a highly thermal conductive, liquid gap filling material. It is provide with two-component and different temperature curing system. The product was supplied as highly thermal conductive, soft and elastomer for coupling on electrical devices modul. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components. It is liquid approach offer variety of thickness, replacing individual die-cut and specific pad thickness. Different from grease, the cured product is dry and can be touch. It can intented for use in thermal applications.
Feature
< Good thermal conductive: 3.0W/mK
< UL recognized
< Naturally tacky needing no further adhesive coating
< Two-part formulation for easy storage
< High durability
< Optimized shear thinning characteristics for ease of dispensing
< Naturally tacky needing no further adhesive coating
< Two-part formulation for easy storage
< High durability
< Optimized shear thinning characteristics for ease of dispensing
Applications
< Notebook
< Set top boxes
< Monitoring the Power Box
< High speed mass storage drives
< Heat sink any heat generating semiconductor
| Typical Properties of TIF030AB-05S Series | |||
| Typical Uncured Material | |||
| Property | Numerical | Test Method | |
| Color/Part A | White | Visual | |
| Color/Part B | Blue | Visual | |
| Viscosity as Mixed (cps) | 500,000 cps | ASTM D2196 | |
| Density | 3.1g/cc | ASTM D792 | |
| Mix Ratio | 1:1 | Ziitek Test Method | |
| Shelf Life@25℃ | 6 months | Ziitek Test Method | |
| Cure Schedule | |||
| Pot Life @25℃ | 30min | Ziitek Test Method | |
| Cure @25℃ | 16 hours | Ziitek Test Method | |
| Cure @100℃ | 1 hours | Ziitek Test Method | |
| Cure Properties | |||
| Color | Blue | Visual | |
| Hardness | 65 shore00 | ASTM D2240 | |
| Continuous Use Temp | -45~200℃ | ****** | |
| Voltage Strength | 275 V/mil | ASTM D149 | |
| Dielectric Constant | 4.6MHz | ASTM D150 | |
| Volume Resistivity | ＞2.0*1012 Ohm-meter | ASTM D257 | |
| Flame Rating | 94V0 | E331100 | |
| Thermal Conductivity | 3.0W/Mk | ISO22007-2 | |
| Specific Heat Capacity | 2.2MJ/m3K | ISO22007-2 | |
Product packing details:
50cc/pc, 48pcs/box; 400cc/pc, 9pcs/box
We offer the custom packaged in Syringes for automated despensing
applications. Please contact us for confirming.
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
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FAQ
Q: Are you trading company or manufacturer?
A: We are manufacturer in Vietnam.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.
TIF030AB-05S Two Component Liquid Easily Thermal Gap Filling Material Silicone Thermal Gel For Power Semiconductor
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