TIF500-40-11U Silicone Thermal Pad Gap Filling For Mass storage devices 

Brand Name:Ziitek
Certification:RoHS
Model Number:TIF500-40-11U
Minimum Order Quantity:1000pcs
Delivery Time:3-5 work days
Payment Terms:T/T
Contact Now

Add to Cart

Verified Supplier
Address: Plot CN4, Ming Lang Industrial Cluster, Vu Thu distric, Thai Binh Province, Vietnam
Supplier`s last login times: within 1 hours
Product Details Company Profile
Product Details

TIF500-40-11U Silicone Thermal Pad Gap Filling For Mass storage devices

Product descriptions


TlF500-40-11U is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF500-40-11U is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.


Features

> Good thermal conductive 4.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Broad range of hardnesses available
> RoHS compliant
> UL recognized
> Easy release construction
> Electrically isolating
> High durability


Application

> Mainboard/mother board
> Notebook
> Power supply
> CPU
> Micro heat pipe thermal solutions
> Telecommunication hardware
> Cooling components to the chassis of frame
> High speed mass storage drives
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units

Typical Properties of TIF500-40-11U Series
PropertyValueTest method
ColorGray*****
Construction &CompostionCeramic filled silicone elastomer*****
Specific Gravity3.15g/ccASTM D297
Thickness range0.020"(0.50mm)~0.200"(5.0mm)ASTM D374
Hardness27 Shore 00ASTM 2240
Continuos Use Temp-45 to 200℃*****
Dielectric Breakdown Voltage>5500 VACASTM D149
Dielectric Constant5.0 MHzASTM D150
Volume Resistivity1.0X10¹² Ohm-meterASTM D257
Flame rating94 V0UL E331100
Thermal conductivity4.0W/m-KASTM D5470

Standard Thicknesses:

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.


Standard Thicknesses

0.020-inch to 0.200-inch (0.5mm to 5.0mm)


Product Sizes:

8" x 16"(203mm x406mm)

Individual die cut shapesand and custom thickness can be supplied.

Please contact us for confirming

Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Company Profile


Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.


Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL


Independent R&D team


Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online.

China TIF500-40-11U Silicone Thermal Pad Gap Filling For Mass storage devices  supplier

TIF500-40-11U Silicone Thermal Pad Gap Filling For Mass storage devices 

Inquiry Cart 0