TIF100-05S Heat Transfer Silicone Pad Thermal Pads Gap Filling Materials GPU Desktop Notebook

Brand Name:Ziitek
Certification:RoHS
Model Number:TIF100-05S
Minimum Order Quantity:1000pcs
Delivery Time:3-5 work days
Payment Terms:T/T
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Address: Plot CN4, Ming Lang Industrial Cluster, Vu Thu distric, Thai Binh Province, Vietnam
Supplier`s last login times: within 1 hours
Product Details Company Profile
Product Details

TIF100-05S Heat Transfer Silicone Pad Thermal Pads Gap Filling Materials GPU Desktop Notebook

Product descriptions


TlF100-05S series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

Features

> Good thermal conductivity
> Naturally tacky needing no furtheradhesive coating
> Soft and Compressible for low stress application
> Available in varies thickness

> Easy release construction
> Electrically isolating
> Moldability for complex parts


Application

> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components


Typical Properties of TIF100-05S Series
PropertyValueTest method
ColorBlue*****
Construction &CompostionCeramic filled silicone elastomer*****
Specific Gravity2.3g/ccASTM D297
Outgassing(TML)0.35%ASTM C351
Hardness45 Shore 00ASTM 2240
Continuos Use Temp-45 to 200℃*****
Dielectric Breakdown Voltage>5500 VACASTM D149
Dielectric Constant4.5MHzASTM D150
Volume Resistivity1.0X10¹² Ohm-meterASTM D257
Flame rating94 V0UL E331100
Thermal conductivity1.5W/m-KASTM D5470

Standard Thicknesses

0.020-inch to 0.200-inch (0.5mm to 5.0mm)


Product Sizes:

8" x 16"(203mm x406mm)

Individual die cut shapesand and custom thickness can be supplied.

Please contact us for confirming


Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company Profile


Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!


Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL


Independent R&D team


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China TIF100-05S Heat Transfer Silicone Pad Thermal Pads Gap Filling Materials GPU Desktop Notebook supplier

TIF100-05S Heat Transfer Silicone Pad Thermal Pads Gap Filling Materials GPU Desktop Notebook

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