TIE280-25AB Two-Component Thermal Conductive Epoxy Adhesive
Brand Name:Ziitek
Certification:UL and RoHs
Model Number:TIE280-25AB
Minimum Order Quantity:2kg/LOT
Delivery Time:3-5 work days
Payment Terms:T/T
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Plot CN4, Ming Lang Industrial Cluster, Vu Thu distric, Thai Binh Province, Vietnam
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Product Details
Company Profile
Product Details
TIE280-25AB Two-Component Thermal Conductive Epoxy Adhesive
TIE™ 280-25AB is a two compound, high thermal conductive, low temperature cured, long pot life, fire resistant epoxy encapsulant compound. It is design for potting of capacitors and electrical devices.
Features
> Good thermal conductive: 2.5W/mK
> Excellent insulation and smoothly sourface.
> Low shrinkage
> Low viscosity, expediting air releaseed.
> Excellent in solvents and water proof.
> Longer life time.
> Excellent thermal shock efficiecy and impact resistance
Application
> Automotive starters potting; General potting Thermal detector potting
> Ferrite adhesion; TIP type LED; Good adhesion to aromatic polyester
> Relay sealant; Good adhesion to rubber, ceramics PCB and plastics
> Power transformers and coils; Potting capacitors Potting of small electrical devices
> Adhesion to metal glass and plastic LCD & substrates adhesion; Coating and sealant; Coil ; IGBTS; Transformer; Fire retardant
> Optical / medical component adhesive
| Typical Properties of TIE280-25AB Series | |||
| Typical Uncured Material | |||
| Typical Uncured Material TIE™ 280-25A (Resin) | Mixing ratio (weight ratio) TIE280-25A:TIE280-25B=100:100 | ||
| Color | Black | ||
| Viscosity@25℃ Brookfield | 3,000 cPs | Viscosity @25℃ Brookfield | 4000 cPs |
| Specific Gravity | 2.1 g/cc | Operating time (@25℃) | 45 mins |
| Shelf life @25℃ in sealed container | 12 months | specific Gravity | 2.1 g/cc |
| TIE™ 280-25B (Hardener) | Mixture Color | Black | |
| Color | Black | Cure Schedule | |
| Viscosity@25℃ Brookfield | 5,000 cPs | Cure at 25℃ | 12 hrs |
| Shelf life @25℃ in sealed container | 12 months | Cure at 70℃ | 30Min |
| Cured Properties | Thermal | ||
| Hardness @25℃ | 85 Shore D | Thermal Conductivity | 2.5 W/m-K |
| Service temperature | -40℃ to +130℃ | Thermal Impedance @10psi | 0.31 ℃-in²/W |
| Glass transition temperature Tg | 92℃ | ELECTRICAL AS CURED | |
| Elongation | 0.10% | Dielectric Strength | 300 volts / mil |
| Coefficient of thermal expansion, / ℃ | 3.0 X 10-5 | Dielectric Constant | 4.2 MHz |
| Fire resistance UL | Meet 94 V-0 | Dissipation factor | 0.029 MHz |
| Moisture absorption % wt gain 24 hours water immersion @25℃ | 0.1 | Volume resistivity, ohm-cm @ 25℃ | 3.0 X 1012 |
Company Profile
Vietnam Ziitek Technology Company Limited. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in Vietnam.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
TIE280-25AB Two-Component Thermal Conductive Epoxy Adhesive
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