TIC800A Manufacture 2.5W Low Melting Point Thermal Interface Materials Thermal Phase Changing Material
Brand Name:Ziitek
Certification:UL & RoHS
Model Number:TIC800A
Minimum Order Quantity:1000pcs
Delivery Time:3-6 work days
Payment Terms:T/T
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Plot CN4, Ming Lang Industrial Cluster, Vu Thu distric, Thai Binh Province, Vietnam
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Product Details
Company Profile
Product Details
TIC800A Manufacture 2.5W Low Melting Point Thermal Interface Materials Thermal Phase Changing Material
The TIC™800A series is low melting point thermal interface material. At 50℃, TIC™800A series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.
TIC™800A series is a flexible solid at room temperature and free standing without reinforcing components that reduce thermal performance.
TIC™800A Series shows no thermal performance degradation after 1,000
hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material
softens and does not fully change state resulting in minimal
migration(pump out)at operating temperatures.
Features
> 0.018℃-in²/W thermal resisitance
> Naturally tacky at room temperature,no adhesive required
> No heat sink preheating required
Applications
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
| Typical Properties of TIC™800A series | ||||
| Product Name | TIC™805A | TIC™808A | TIC™810A | Test Method |
| Color | Gray | Visual | ||
| Thickness | 0.005"/0.126mm | 0.008"/0.203mm | 0.010"/0.245mm | ****** |
| Thickness Tolerance | ±0.0008"/±0.019mm | ±0.0008"/±0.019mm | ±0.0012"/±0.030mm | ****** |
| Density | 2.5 g/cc | Helium Pycnometer | ||
| Temperature range | -25 to 125℃ | ****** | ||
| Phase Change Softening Temperature | 50℃-60℃ | ****** | ||
| Thermal conductivity | 2.5W/mK | ASTM D5470 | ||
| Thermal Impedance@50psi(345KPa) | 0.055℃-in²/W 0.35℃-cm²W | 0.062℃-in²/W 0.40℃-cm²W | 0.074℃-in²/W 0.48℃-cm²W | ASTM D5470 |
Standard Thicknesses:
0.005"(0.126mm) ,0.008"(0.203mm), 0.010"(0.254mm)
Consult the factory alternate thickness.
Standard Sizes:
10" x 16"(254mm x 406mm) , 16"x400(406mm x 121.92m)
TIC800A series are supplied with a white release paper and a bottom liner.
TIC800A series is available in kiss cut an extended pull tab liner or individual die cut shapes.
Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC800A series
products.
Reinforcement:
No reinforcement is necessary.
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in Vietnam.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just contact us by send email or call us.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
TIC800A Manufacture 2.5W Low Melting Point Thermal Interface Materials Thermal Phase Changing Material
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